Semiconductor storage unit

ABSTRACT

A semiconductor storage unit to be disclosed includes a bank block ( 23   1 ) having banks ( 25   1 ) and ( 25   2 ) with memory cell arrays ( 31   1 ) and ( 31   2 ), global I/O lines ( 26   1 ) and ( 26   2 ), I/O amplifier ( 28   1 ) and ( 28   2 ) and column decoder groups ( 35   1 ) and ( 35   2 ); and a bank selective circuit ( 29   1 ) provided in common with the bank blocks ( 25   1 ) and ( 25   2 ) that produces a column select signal YS 0  or YS 1  for activating the corresponding column decoder on the basis of bank select signals BS 0  to BS 2  and /BS 0  to /BS 2  and a column multi-select delay signal YMD 0  for activating the corresponding I/O amplifier ( 28   1 ) or ( 28   2 ). Thereby, it is possible to reduce the number of wiring lines in a semiconductor storage unit with a plurality of banks and to normally perform a test such as fault analysis or the like.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor storage unit and in particular to a semiconductor storage unit with a plurality of banks.

2. Description of the Prior Art

FIG. 33 shows one example of electric configuration of the conventional semiconductor storage unit disclosed in Japanese Patent Application No. 9-305505, where (a) and (b) are a block diagram showing the electric configuration of the main part and a circuit diagram showing a configurational example of a circuit provided inside the block diagram shown in FIG. 33(a), respectively.

As shown in FIG. 33(a), the semiconductor storage unit of this example comprises two banks 2 a and 2 b with a plurality of subarrays 1, 1, . . . arranged in a matrix form. The banks 2 a and 2 b each comprise: the respective sense amplifier columns (SA) 3, 3, . . . and the respective subword driver columns (SWD) 4, 4, . . . for individual subarrays 1, 1, . . . the respective subword lines (SWL) 5, 5, . . . wired in the X direction (horizontal direction in the figure) of a subarray 1 for individual subarrays 1, 1, . . . ; and the respective bit lines (BL) 6, 6, . . . wired in the Y direction (vertical direction in the figure) of a subarray 1 for individual subarrays 1, 1, . . . ; the respective local I/O lines (LIO) 7, 7, . . . and the respective main word lies (MWL) 8, 8, . . . wired in the X direction of a subarray 1; and the respective column selection line (CSL) 9, 9, . . . wired in the Y direction of a subarray 1 for individual subarrays 1, 1, . . . .

Besides, provided in common to the banks 2 a and 2 b are global I/O lines (GIO) 11 connected to I/O amplifiers 10 ₀ and 10 ₁, comprising write amplifiers, data amplifier or the like in the Y direction of subarray 1, controlled by a logical sum of signals conveyed over a column selection line 9, and switch lines (SWIO) 12 which is wired in the same direction as the global I/O lines 11 with one for each arranging column of the global I/O lines 11 and along which signals RWSRj indicating the active state of columns for connecting local I/O lines 7 and global I/O lines 11 are conveyed.

Next, the operation of the semiconductor storage unit configured above will be described. First, when the bank 2 a is selected in accordance with a signal RACTj conveyed over the signal line 13 for indicating the active state of the row, a main word line 8 and a sub-word line 5 provided on the bank 2 a are activated and moreover a signal SE for activating the sense amplifier column 3 stands up. When a sub-word line 5 is activated, bit lines 6 connected to the sub-word line 5 are gradually activated. Besides, activation of the sense amplifier column 3 by the signal SE causes the leading of a signal SAP.

Next, at the same time when a column selection line 9 provided on any subarray 1 is activated, a switch line 12 for connecting a local I/O line 7 and a global I/O line 11 provided on the subarray 1 is activated. Thereby, the local I/O line 7 and the global I/O line 11 provided on the subarray 1 are connected, both of them are gradually activated, and the data written in the memory cell 14 present on a bit line 6 of a desired subarray 1 in the bank 2 a are read out.

Thereafter, when the column selection line 9 and the switch line 12 in the bank 2 a becomes inactive and a column selection line 9 and a switch line 12 in the bank 2 b are activated instead, a local I/O line 7 and a global I/O line 11 provided on the subarray 1 in the bank 2 b are connected, both of them are gradually activated, and the data written in the memory cell 14 present on a bit line 6 of a desired subarray 1 in the bank 2 b are read out.

Incidentally, the operation till the column selection line 9 and the switch line 12 in the bank 2 b are activated will be omitted, because of being almost similar to that in the bank 2 a.

BRIEF SUMMARY OF THE INVENTION

Object of the Invention

Meanwhile, in the above conventional semiconductor unit, indeed since global I/O lines 11 are provided in common to the banks 2 a and 2 b and moreover switch lines 12 are wired with one for each arranging column of the global I/O lines 11 in the same direction as the global I/O lines 11, the number of wiring lines can be reduced and the chip area can be minimized as compared with a case where they are provided respectively for individual banks or for individual subarrays.

In the conventional semiconductor unit, however, since the number of signal lines for conveying the signal of an I/O amplifier 10 or signal lines for conveying the signal for activating a column decoder (YDEC in FIG. 33) or the like cannot be reduced, there was a limit to the reduction of the chip area in the semiconductor storage unit.

Besides, in the above semiconductor storage unit, since global I/O lines 11 are provided in common to the banks 2 a and 2 b, the time taken to convey data on a global I/O line 11 lengthens as compared with a case where I/O lines are provided respectively for individual banks. Accordingly, considering the delay of data on a global I/O line 11, a column decoder or an I/O amplifier must be activated, but no account whatever is made of this point in the conventional semiconductor storage unit. For this reason, with the connecting configuration of the I/O amplifier 100 and the I/O amplifier 10, to a common data I/O bus, for example, there is a fear that data read out from the respective banks 2 might collide with each other on a data I/O bus in a continuous readout of data from the banks 2 a and 2 b.

Furthermore, in the above conventional semiconductor storage unit, a local I/O line 7 and a global I/O line 11 are connected in accordance with a signal RWS_(j) conveyed on the switch line 12, but no generation circuit for generating a signal RWS_(j) is disclosed. Thus, there was a disadvantage in that switching for selecting the connection to a local I/O line 7 and the connection to a global I/O line 11 cannot be concretely implemented without any damage to data read from the banks 2 a and 2 b or data written into the banks 2 a and 2 b.

Besides, Japanese Patent Application No. 9-305505 describes that short-circuiting a global I/O line 11 during the switching period between the control over the bank 2 a and the control over the bank 2 b shortens the time until the subsequent operation begins, but discloses no specific circuits whatever. Thus, there was a disadvantage in that no speedup of operation in the switching time mentioned above is specifically implementable.

Besides, in a large capacity semiconductor storage unit, the test mode in which data are written into a plurality of bank at a time or read out at a time is provided to shorten the time for a fault analysis or an estimating test and there are cases where a test signal for this mode is supplied to the semiconductor storage unit. In the case of a global I/O lines 11 provided in common to the upper and lower banks 2 a and 2 b like the above conventional semiconductor storage unit, there was another demerit that supplying a test signal as it is allows data read out from individual banks 2 a and 2 b and conveyed to collide with each other in the global I/O line 11, thereby disabling the test to be normally carried out because the upper and lower buses are simultaneously activated.

Fulfilled in consideration of these circumstances, the present invention has an object in providing a semiconductor storage unit enabling the number of wiring lines to be reduced as well as the collision of data on data I/O buses to be prevented and capable of switching the connection between a local I/O line and a global I/O line without occurrence of damages to data, implementing speedup of the operation in the switching time of control for upper and lower banks and further performing a test normally and in a short time about fault analysis or the like.

SUMMARY OF THE INVENTION

To solve these problems, a semiconductor storage unit claimed in claim 1 comprises: a plurality of bank blocks including a plurality of banks with a memory cell array composed of a plurality of memory cells placed in a matrix form, neighboring to each other, a plurality of global I/O lines provided in parallel to the arranging direction of the above banks and in common therewith for conveying data read out from any of the memory cells in a memory cell array configuring the above banks or data to be written in any of the memory cells, a plurality of I/O amplifiers connected to individual global I/O lines for amplifying data conveyed by corresponding global I/O lines or data to be conveyed from this on, and a plurality of column decoders provided in common to the above banks for respectively outputting a plurality of column selection switches for setting the bit lines corresponding to the memory cell array configuring any of the banks at the selected state; and a plurality of bank selective circuit, provided in common with the bank configuring a corresponding bank block for each of the above bank blocks which produce a column decoder activation signal for activating the corresponding column decoder in accordance with multi-bit bank address signal for selecting any one of all banks configuring the above bank blocks and an I/O amplifier activation signal for activating the corresponding I/O amplifier.

The invention claimed in claim 2 relates to a semiconductor storage unit as set forth in claim 1, characterized in that the above bank selective circuits makes a logical sum of bank selection signals for selecting any one of the banks configuring the corresponding bank block produced from the above multi-bit bank address signal and produces the above I/O amplifier activation signal.

The inventions claimed in claims 3 and 4 relate to a semiconductor storage unit as set forth in claim 1 or 2, characterized in that the above bank selective circuits makes a logical sum of bank selection signals for selecting any one of the banks configuring the corresponding bank block produced from the above multi-bit bank address signal and produces the above column decoder activation signal.

The invention claimed in claim 5 relates to a semiconductor storage unit as set forth in claim 1, characterized in that the above bank selective circuits produce the above column decoder activation signal and the above I/O amplifier activation signal in accordance with a bank block selection signal for selecting a corresponding bank block, produced from a part of the bits configuring the above multi-bit bank address signal.

The inventions claimed in claims 6 to 8 relates to a semiconductor storage unit as set forth in any one of claims 1 to 3, characterized in that in place of the above column decoder activation signal and the above I/O amplifier activation signal, the above bank selective circuits output the respective signals making logical product of the multi-bits corresponding to the banks configuring the bank block of the above multi-bit column address signals with the above column decoder activation signal and the above I/O amplifier activation signal.

The inventions claimed in claims 9 to 11 relate to a semiconductor storage unit as set forth in any one of claims 1 to 3, characterized in that the above bank selective circuits comprises a test circuit that make a logical sum of a test signal for accomplishing a fault analysis or an estimation test with the above bank selection signal or the above bank block selection signal to produce at least one of the above I/O amplifier activation signal or the above column decoder activation signal and make a logical product between the respective signals making a logical product of the above test signal with the multi-bits corresponding to the banks configuring the bank block of a multi-bit column address signal and the signal making a logical product of the inverted signal of the above test signal with the above column decoder activation signal to produce a column decoder signal for each bank.

The inventions claimed in claims 12 to 14 relate to a semiconductor storage unit as set forth in any one of claims 1 to 3, characterized in that the above bank selective circuits make a logical sum between the respective signals making a logical product of a test signal for accomplishing a fault analysis or an estimation test with the multi-bits corresponding to the banks configuring the bank block of a multi-bit column address signal and the above bank selection signal or the above bank block selection signal to produce at least one of the above I/O amplifier activation signal or the above column decoder activation signal.

The inventions claimed in claims 15 to 17 relate to a semiconductor storage unit as claimed in any one of claims 1 to 3, characterized in that the above bank selective circuits output the above I/O amplifier activation signal after the delay of a predetermined time from the input of the above multi-bit bank address signal.

The inventions claimed in claims 18 to 20 relate to a semiconductor storage unit as set forth in any one of claims 15 to 17, characterized in that with the difference of a predetermined time between the write time of data and the readout time of data, the above bank selective circuits output the above I/O amplifier activation signal.

The inventions claimed in claims 21 to 23 relate to a semiconductor storage unit as claimed in any one of claims 1 to 3, characterized in that the above bank blocks each comprises a connection selective circuit with a plurality of local I/O lines, provided perpendicularly to the above global I/O lines for the above individual memory cell array and allowed to convey data read out from any of the memory cells or data to be written into any of the memory cells in the corresponding memory cell array by being connected to a corresponding global I/O line, for selecting the connection between the above local I/O lines and their corresponding global I/O lines at predetermined intervals in accordance with the above column decoder activation signal.

The inventions claimed in claim 24 and 26 relate to a semiconductor storage unit as claimed in any one of claims 1 to 3, further comprising: an initialization circuit for short-circuiting and initializing the corresponding global I/O line in accordance with the above column decoder activation signal at the time of switchover of data readout from a certain bank to data readout from another bank in a continuous readout case of data from a plurality of banks provided corresponding to the above global I/O line configuring one and the same bank block.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram showing the electric configuration of the main part of a semiconductor storage unit according to Embodiment 1 of the present invention;

FIGS. 2(A) and 2(B) are block diagrams showing an example of a chip layout of the semiconductor storage unit;

FIG. 3 is a block diagram showing an example of the configuration of a precharge global I/O circuit configuring the semiconductor storage unit;

FIG. 4 is a block diagram showing an example of the configuration of a bank select circuit configuring the semiconductor storage unit;

FIG. 5 is a block diagram showing an example of the configuration of a first column control section configuring the semiconductor storage unit;

FIG. 6 is a block diagram showing an example of the configuration of a second column control section configuring the semiconductor storage unit;

FIG. 7 is a timing chart showing an example of the operation of the semiconductor storage unit;

FIG. 8 is a timing chart showing an example of the operation of the first column control section configuring the semiconductor storage unit;

FIG. 9 is a timing chart showing an example of the operation of the semiconductor storage unit;

FIG. 10 is a timing chart showing an example of the operation of the second column control section configuring the semiconductor storage unit;

FIG. 11 is a block diagram showing the electric configuration of the main part of a semiconductor storage unit according to Embodiment 2 of the present invention;

FIG. 12 is a block diagram showing an example of the configuration of a bank select circuit configuring the semiconductor storage unit;

FIG. 13 is a timing chart showing an example of the operation of e semiconductor storage unit;

FIG. 14 is a timing chart showing an example of the operation of the semiconductor storage unit;

FIG. 15 is a block diagram showing the electric configuration of the main part of a semiconductor storage unit according to Embodiment 3 of the present invention;

FIG. 16 is a block diagram showing an example of the configuration of a bank select circuit configuring the semiconductor storage unit;

FIG. 17 is a timing chart showing an example of the operation of the semiconductor storage unit;

FIG. 18 is a timing chart showing an example of the operation of the semiconductor storage unit;

FIG. 19 is a block diagram showing an example of the electric configuration of the main part of a semiconductor storage unit according to Embodiment 4 of the present invention;

FIG. 20 is a block diagram showing an example of the configuration of a bank select circuit configuring the semiconductor storage unit;

FIG. 21 is a block diagram showing an example of the electric configuration of the main part of a semiconductor storage unit according to Embodiment 5 of the present invention;

FIG. 22 is a block diagram showing an example of the configuration of a bank select circuit configuring the semiconductor storage unit;

FIG. 23 is a block diagram showing an example of the configuration of a test circuit configuring the semiconductor storage unit;

FIG. 24 is a block diagram showing an example of the electric configuration of the main part of a semiconductor storage unit according to Embodiment 6 of the present invention;

FIG. 25 is a block diagram showing an example of the configuration a bank select circuit configuring the semiconductor storage unit;

FIG. 26 is a block diagram showing an example of the configuration f a bank select circuit configuring a semiconductor storage unit according to Embodiment 7 of the present invention;

FIG. 27 is a block diagram showing an example of the configuration of a bank select circuit configuring a semiconductor storage unit according to Embodiment 8 of the present invention;

FIG. 28 is a timing chart showing an example of the operation of the semiconductor storage unit;

FIG. 29 is a block diagram showing an example of the configuration of a bank select circuit configuring a semiconductor storage unit according to Embodiment 9 of the present invention;

FIG. 30 is a block diagram showing an example of the configuration of a bank select circuit configuring a semiconductor storage unit according to Embodiment 10 of the present invention;

FIG. 31 a block diagram showing an example of the configuration of a bank select circuit configuring a semiconductor storage unit according to Embodiment 11 of the present invention;

FIG. 32 is a schematic block diagram showing another example of the chip layout of the semiconductor storage unit according to the present invention; and

FIGS. 33(A) and 33(B) are block diagrams showing examples of the electric configuration of a conventional semiconductor storage unit: FIG. 33 (A) is a block diagram showing an example of the electric configuration of the main part; and FIG. 33(B) is a block diagram showing an example of the configuration of a circuit provided inside the block diagram shown in FIG. 33(A).

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, referring to the drawings, embodiments of the present invention will be described. Embodiments are used to specifically make a description.

A. Embodiment 1:

FIG. 1 is a block diagram showing the electric configuration of the main part of a semiconductor storage unit according to Embodiment 1 of the present invention. FIG. 2 is one example of a chip layout of the storage device.

As shown in FIG. 2 (B), the semiconductor storage unit of this example broadly comprises a functional block 21 ₁ and 21 ₂ and a peripheral circuit block 22. The functional block 21 ₁ and the functional block 21 ₂ differ in the index of components and moreover are the same in configuration except I/O signals and data, so that only the functional block 21 ₁ will be described. The functional block 21 ₁ broadly comprises bank blocks 23 ₁ and 23 ₂ and a peripheral circuit block 24 ₁. As shown in FIG. 2 (A), the bank block 23 ₁ and the bank block 23 ₂ are related in plane symmetry concerning the plane perpendicular to the sheet surface at the portion of the peripheral circuit block 24 ₁ except word drivers 32 ₁ and 32 ₂ and word drivers 32 ₃ and 32 ₄. These bank block 23 ₁ and the bank block 23 ₂ differ in the index of components and moreover are the same in configuration except I/O signals and data, so that only the bank block 23 ₁ will be described.

As shown in FIG. 1, the bank block 23 ₁ broadly comprises bank 25 ₁ and 25 ₂, global I/O lines 26 ₁ and 26 ₂, switch lines 27 _(1a), 27 _(1b), 27 _(2a) and 27 _(2b), I/O amplifier 28 ₁ ad 28 ₂ and a bank selective circuit 29 ₁.

The bank 25 ₁ broadly comprises a memory cell array 31 ₁, a word driver 32 ₁, sense amplifiers 33 ₁ and 33 ₂ and local I/O lines 34 ₁ to 34 ₄, whereas the bank 25 ₂ broadly comprises a memory cell array 31 ₂, a word driver 32 ₂, sense amplifiers 33 ₃ and 33 ₄ and local I/O lines 34 ₅ to 34 ₈. Provided between the bank 25 ₁ and the bank 25 ₂ are column decoder groups 35 ₁ and 35 ₂ and precharge global I/O circuits 36 ₁ and 36 ₂.

In memory cell arrays 31 ₁ and 31 ₂, a plurality of memory cells are disposed in the shape of a matrix and divided in two. The word drivers 32 ₁ and 32 ₂ provided respectively corresponding to individual word lines of memory cell arrays 31 ₁ and 31 ₂ and drive the word lines made in the selection state by the row decoder groups 48 ₁ and 48 ₂ configuring the peripheral circuit block 24 ₁. The sense amplifiers 33 ₁ to 33 ₄ detect and amplify data read out from a memory cell in the row selected of the memory cell arrays 31 ₁ and 31 ₂ to a bit line. On respectively being connected to the global I/O lines 26 ₁ and 26 ₂, the local I/O lines 34 ₁ and 34 ₈ transmit the data detected and amplified in the sense amplifiers 33 ₁ to 33 ₄ at the time of data readout and convey the data conveyed by the global I/O lines 26 ₁ and 26 ₂ to memory cells selected in the memory cell arrays 31 ₁ and 31 ₂ at the time of data write.

The column decoder groups 35 ₁ and 35 ₂, provided in common to the banks 25 ₁ and 25 ₂, comprise a plurality of column decoders for respectively outputting a plurality of column select switches, e.g. CSL₁₀ to CSL₁₃ and CSL₂₀ to CSL₂₃, serving to set the sense amplifiers 33 ₁ to 33 ₄ connected to the corresponding bit lines of the memory cell arrays 31 ₁ and 31 ₂ at the selection state on the basis of column select signals YS₀ and YS₁ supplied from the bank selective circuit 29 ₁ (e.g. for 8-bank arrangement, the indices take 0 to 7 corresponding to banks 25 ₁ to 25 ₈).

The precharge global I/O circuits 36 ₁ and 36 ₂, provided corresponding to the global I/O lines 26 ₁ and 26 ₂, set the global I/O lines 26 ₁ and 26 ₂ at the precharge state by short-circuiting the global I/O lines in an access at the time of data readout in accordance with a precharge global signal PG₀, taking the “L” level, for example, only in one shot (e.g. for 8-bank arrangement, the indices take 0 to 7 corresponding to the banks 25 ₁ to 25 ₈) supplied from the second column control section 50 ₁ configuring the peripheral circuit block 24 ₁. Thereby, the corresponding column select switch is selected and data read out into a bit line and being in the progress of amplification by the sense amplification 33 ₁ to 33 ₄ are rapidly conveyed to the local I/O lines 34 ₁ to 34 ₈ without destruction.

Here, one example of arrangement for the precharge global I/O circuit 36 ₁ is shown in FIG. 3. The precharge global I/O circuit 36 ₁ broadly comprises an inverter 37 ₁ for inverting a precharge global signal PG₀, an inverter 38 ₁ for inverting an output signal of the inverter 37 ₁, an N-channel FET 39 ₁ for turning ON in response to an output signal of the inverter 37 ₁ to shunt a pair of global I/O lines 26 ₁, a P-channel FET 40 ₁ for turning ON in response to an output signal of the inverter 38 ₁ to shunt a pair of global I/O lines 26 ₁, an N-channel FET 41 ₁ for turning ON in response to an output signal of the inverter 37 ₁ to apply an electric current voltage to one of a pair of global I/O lines 26 ₁ and an N-channel FET 42 ₁ for turning ON in response to an output signal of the inverter 37 ₁ to apply an electric current voltage to the other of a pair of global I/O lines 26 ₁. Incidentally, the arrangement for the precharge global I/O circuit 36 ₂ differs in the index of components and moreover are identical to that of the precharge global I/O circuit 36 ₁ except for different indices of inputted/outputted signals, so that the description thereof will be omitted.

The global I/O lines 26 ₁ and 26 ₂ shown in FIG. 1, provided in the common to the banks 25 ₁ and 25 ₂, convey data conveyed by the local I/O lines 34 ₁ to 34 ₈ respectively to the I/O amplifiers 28 ₁ and 28 ₂ and moreover convey data from the I/O amplifier 28 ₁ and 28 ₂ respectively to the local I/O lines 34 ₁ to 34 ₈. The switch lines 27 _(1a), 27 _(1b), 27 _(2a) and 27 _(2b), disposed in parallel to the global I/O lines 26 ₁ and 26 ₂ and corresponding to the memory cell arrays 31 ₁ and 31 ₂ divided in two, convey switch signals SW₀ and SW₁ (indices take 0 to 7 corresponding to the banks 25 ₁ to 25 ₈), supplied from the second column control section 50 ₁ configuring the peripheral circuit block 24 ₁. The switch signals SW₀ and SW₁ are signals for connecting the corresponding global I/O lines 26 ₁ and 26 ₂ to the local I/O lines 34 ₁ to 34 ₈ perpendicular to each of the global I/O lines 26 ₁ and 26 ₂ at the switchover time of an access to the bank 25 ₁ and an access to the bank 25 ₂.

The I/O amplifiers 28 ₁ and 28 ₂, provided in common to the banks 25 ₁ and 25 ₂, broadly comprise a data amplifier activated by a column multi-select delay signal YMD₀ supplied from the bank selective circuit 29 ₁ (indices take 0 to 3 corresponding to the bank blocks 23 ₁ to 23 ₄), detected and amplified in the sense amplifiers 33 ₁ to 33 ₄ and supplied via the local I/O lines 34 ₁ to 34 ₈ and the global I/O lines 26 ₁ and 26 ₂, and a write amplifier activated similarly by column multi-select delay signal YMD₀ to amplify data supplied from the data I/O circuit 114 ₁ via the data I/O bus 115 ₁ and 115 ₂.

On the basis of enable signals PN₀ and PN₁ supplied from enable circuits 113 ₁ and 113 ₂ configuring the peripheral circuit block 22, the bank selective circuit 29 ₁, provided in common to the banks 25 ₁ and 25 ₂, produces column select signals YS₀ to YS₇ for the control of a plurality of column decoders configuring the column decoder groups 35 ₁ and 35 ₂ and column multi-select delay signals YMD₀ to YMD₃.

Here, FIG. 4 shows one example of configuration of a bank selective circuit 29 ₁. The bank selective circuit 29 ₁ broadly comprises a buffer 43 ₁ for buffering an enable signal PN₀ to output it as a column select signal YS₀, a buffer 44 ₁ for buffering an enable signal PN₁ to output it as a column select signal YS₁, an OR gate 45 ₁ for making a logical sum of an enable signal PN₀ and an enable signal PN₁, a delay element 46 ₁ for delaying an output signal of the OR gate 45 ₁ to cancel the delay (skew delay) for a predetermined time in column decoders configuring the column decoder groups 35 ₁ and 35 ₂ and a buffer 47 ₁ for buffering an output signal of the delay element 46 ₁ to output it as a column multi-select delay signal YMD₀.

As shown FIG. 2(a), the peripheral circuit block 24 ₁ broadly comprises row decoder groups 48 ₁ and 48 ₂, a first column control section 49 ₁ and second column control section 50 ₁ and 50 ₂. The first column control section 49 ₁ and the second column control section 50 ₁ and 50 ₂ constitute a column control circuit.

The row decoder groups 48 ₁ and 48 ₂, respectively provided corresponding to the individual word lines of memory cell arrays 31 ₁ as well as 31 ₃ and memory cell arrays 31 ₂ as well as 31 ₄, include a plurality of row decoders for decoding unshown row address signals to thus set the corresponding word lines of the memory cell arrays 31 ₁ as well as 31 ₃ and the memory cell arrays 31 ₂ and 31 ₄, respectively, to the selected state.

On the basis of a write burst signal WBT₀ (indices take 0 to 7 corresponding to banks 25 ₁ to 25 ₈, while two write burst signals WBT with the same index as the index attached to two banks 25 commonly connected to a global I/O line 26 control either representatively corresponding bank 25) indicating, e.g. the write burst period during the “H” level, supplied from the controller 113 configuring the peripheral circuit block 22 and a column release signal YR₀ (indices take 0 to 7 corresponding to banks 25 ₁ to 25 ₈) for defining the occurring time of various signals, the first column control section 49 ₁ produces a column release delay inverted signal YRD₀ (indices take 0 to 7 corresponding to banks 25 ₁ to 25 ₈) obtained by delaying the column release signal YR₀ for a predetermined period and inverting the resultant, a column release rear signal YRR₀ (indices take 0 to 7 corresponding to banks 25 ₁ to 25 ₈) indicating the rear of the column release signal YR₀, and a column release front signal YRF₀ (indices take 0 to 7 corresponding to banks 25 ₁ to 25 ₈) indicating the front of the column release signal YR₀ and moreover produces a column release center signal YRC₀ (indices take 0 to 7 corresponding to banks 25 ₁ to 25 ₈) indicating the center of the column release signal YR₀ if the write burst signal WBT₀ is a “L” level.

Here, FIG. 5 shows one example of first column control section 49 ₁. The first column control section 49 ₁ broadly comprises delay elements 51 ₁, 52 ₁, 53 ₁, 54 ₁, 55 ₁ and 56 ₁, inverters 57 ₁, 58 ₁, 59 ₁, 60 ₁, 61 ₁, 62 ₁, 63 ₁, 64 ₁, 65 ₁, 66 ₁ and 67 ₁, a transfer gate 68 ₁ and NAND gates 69 ₁, 70 ₁ and 71 ₁. The delay element 53 ₁ delays a column release signal YR₀ for a time T₁, the delay element 52 ₁ delays an output signal S₁ of the delay element 53 ₁ for a predetermined time and the inverter 63 ₁ inverts an output signal of the delay element 52 ₁ to output the resultant as column release delay inverted signal YRD₀. The delay element 51 ₁ delays a column release signal YR₀ for a predetermined time, the delay element 54 ₁ delays an output signal of the delay element 53 ₁ for a predetermined time and the inverter 61, inverts an output signal of the delay element 54 ₁, the delay element 55 ₁ delays an output signal S2 ₂ of the inverter 61 ₁ for a predetermined time and the inverter 62 ₁ inverts an output signal of the delay element 55 ₁. Thereby, the NAND gate 69 ₁ makes a logical product of an output signal of the delay element 51 ₁ and an output signal S₃ of the inverter 62 ₁ to thus invert and output the resultant and the inverter 64 ₁ inverts an output signal of the NAND gate 69 ₁ and outputs the resultant as column release rear signal YRR₀. Besides, the NAND gate 70 ₁ makes a logical product of an output signal of the delay element 51 ₁ and an output signal of the inverter 61 ₁ and inverts and outputs the resultant as column release front signal YRF₀. The inverter 57 ₁ inverts a write burst signal WBT₀ and the inverter 58 ₁ inverts a column release signal YR₀. Thereby, the transfer gate 64 ₁ is turned ON/OFF by a column release signal YR₀ or an output signal of the inverter 58 ₁, thus allowing an output signal of the inverter 57 ₁ to pass. The inverter 59 ₁ inverts an output signal of the transfer gate 68 ₁, the inverter 60 ₁ inverts an output signal of the inverter 59 ₁ to supply the resultant to the inverter 59 ₁, the inverter 66 ₁ inverts an output signal of the inverter 59 ₁, the delay element 56 ₁ delays an output signal of the NAND gate 70 ₁ for a predetermined time and the inverter 65 ₁ inverts an output signal of the delay element 56 ₁. Thereby, the NAND gate 71 ₁ makes a logical product of an output signal of the inverter 66 ₁ and an output signal S₄ of the inverter 65 ₁ to invert and output the resultant and the inverter 67 ₁ inverts an output signal of the NAND gate 71 ₁ to output the resultant as a column releases center signal YRC₀.

Besides, on the basis of column select signals YS₀, YS₁, YS₂ and YS₃ (the respective indices take 0 to 7 corresponding to banks 25 ₁ to 25 ₈) supplied respectively from the bank selective circuits 29 ₁ and 29 ₂ configuring the bank blocks 23 ₁ and 23 ₂, a mode register reset signal MRS of resetting a mode register provided at a controller 113 configuring the peripheral circuit 22 for temporarily holding various information items corresponding to commands of the mode register set, supplied from the outside, and a column release delay inverted signal YRD₀, a column release rear signal YRR₀, a column release front signal YRF₀ and a column release center signal YRC₀ supplied from the first column control section 49 ₁, the second column control section 50 ₁ and 50 ₂ shown in FIG. 2(a), respectively provided corresponding to the bank blocks 23 ₁ and 23 ₂, produce switch signals SW₀ and SW₁, column decode latch signals YPT₀ and YPT₁ (the respective indices take 0 to 7 corresponding to banks 25 ₁ to 25 ₈) for latching the inside address signals YP₀ to YP_(m) (e.g. m=0 to 12 for k=0 to 15) produced from address signals A₀ to A_(k) (e.g. k=0 to 15) supplied from the outside to activate a plurality of column decoder configuring the column decoder groups 35 ₁ and 35 ₂, column select inverted signals YSB₀ and YSB₁ (the respective indices take 0 to 7 corresponding to banks 25 ₁ to 25 ₈) for inactivating a plurality of column decoders configuring the column decoder groups 35 ₁ and 35 ₂, and a precharge global signal PG₀ for short-circuiting the global I/O line 26 ₁ or 26 ₂ to set it to the precharge state prior to an access in the time of data readout.

Here, FIG. 6 shows one configurational example of second column control section 50 ₁. The second column control section 50 ₁ broadly comprises inverters 72 ₁, 73 ₁, 74 ₁, 75 ₁, 76 ₁, 77 ₁, 78 ₁, 79 ₁, 80 ₁, 81 ₁, 82 ₁, 83 ₁, 84 ₁, 85 ₁, 86 ₁, 87 ₁, 88 ₁, 89 ₁, 90 ₁, 91 ₁ and 92 ₁, transfer gates 93 ₁, 94 ₁, 95 ₁ and 96 ₁ and NAND gates 97 ₁, 98 ₁, 99 ₁, 100 ₁, 101 ₁, 102 ₁, 103 ₁, 104 ₁, 105 ₁ and 106 ₁.

The inverter 72 ₁ inverts a column select signal YS₀, the inverter 73 ₁ inverts a column select signal YS₁, and the inverter 74 ₁ inverts a column release delay inverted signal YRD₀. Thereby, the transfer gates 93 ₁ and 94 ₁ are turned ON/OFF by a column release delay inverted signal YRD₀ or output signals of the inverter 74 ₁, thereby allowing output signals of the inverters 72 ₁ and 73 ₁ to pass therethrough respectively. The inverter 75 ₁ inverts a mode register reset signal MRS, the inverter 76 ₁ inverts an output signal of the transfer gate 93 ₁ and the inverter 79 ₁ inverts an output signal of the transfer gate 94 ₁. Thereby, the NAND gate 97 ₁ makes a logical product of an output signal of the inverter 76 ₁ and an output signal of the inverter 75 ₁ to invert and supply the resultant to the inverter 79 ₁ and the NAND gate 98 ₁ makes a logical product of an output signal of the inverter 79 ₁ and an output signal of the inverter 75 ₁ to invert and supply the resultant to the inverter 79 ₁. The inverter 77 ₁ inverts an output signal of the inverter 76 ₁ and the inverter 78 ₁ inverts and outputs an output signal of the inverter 77 ₁ as a switch signal SW₀. The inverter 80 ₁ inverts an output signal of the inverter 79 ₁ and the inverter 81 ₁ inverts and outputs an output signal of the inverter 80 ₁ as a switch signal SW₁.

The inverter 82 ₁ inverts a column release front signal YRF₀ and the transfer gates 95 ₁ and 96 ₁ are turned ON/OFF by a column release front signal YRF₀ or output signals of the inverter 82 ₁, thereby allowing output signals of the inverters 72 ₁ and 73 ₁ to respectively pass therethrough. The inverter 83 ₁ inverts an output signal of the transfer gate 95 ₁ and the inverter 84 ₁ inverts an output signal of the transfer gate 96 ₁. Thereby, the NAND gate 99 ₁ makes a logical product of an output signal of the inverter 83 ₁ and an output signal of the inverter 75 ₁ to invert and supply the resultant to the inverter 83 ₁ and the NAND gate 100 ₁ makes a logical product of an output signal of the inverter 84 ₁ and an output signal of the inverter 75 ₁ to invert and supply the resultant to the inverter 84 ₁. The NAND gate 103 ₁ makes a logical product of a column release rear signal YRR₀ and an output signal of the inverter 83 ₁ to invert and output the resultant, then the inverter 85 ₁ inverts and outputs an output signal of the NAND gate 103 ₁ as a column predecode latch signal YPT₀.

Besides, the NAND gate 104 ₁ makes a logical product of a column release rear signal YRR₀ and an output signal of the inverter 84 ₁ to invert and output the resultant as a column predecode latch signal YPT₁.

The NAND gate 105 ₁ makes a logical product of an output signal of the inverter 83 ₁ and an output signal of the inverter 82 ₁ to invert and output the resultant, the inverter 87 ₁ inverts an output signal of the NAND gate 105 ₁ and the inverter 881 inverts an output signal of the inverter 87 ₁ to output the resultant as a column select inverted signal YSB₀. Besides, the NAND gate 106 ₁ makes a logical product of an output signal of the inverter 84 ₁ and an output signal of the inverter 82 ₁ to invert and output the resultant, the inverter 89 ₁ inverts an output signal of the NAND gate 106 ₁ and the inverter 90 ₁ inverts an output signal of the inverter 89 ₁ to output the resultant as a column select inverted signal YSB₁.

The NAND gate 101 ₁ makes a logical product of an output signal of the inverter 72 ₁ and an output signal of the inverter 73 ₁ to invert and output the resultant, the NAND gate 102 ₁ makes a logical product of an output signal of the NAND gate 102 ₁ and a column release center signal YRC₀ to invert and output the resultant, the inverter 91 ₁ inverts an output signal of the NAND gate 102 ₁ and an inverter 92 ₁ inverts an output signal of the inverter 91 ₁ to output the resultant as a precharge global signal PG₀.

Incidentally, in the above circuit configuration, an example of respectively making column predecode latch signals YPT₀ and YPT₁, column select inverted signals YSB₀ and YSB₁ and switch signals SW₀ and SW₁ in the one-to-one correspondence of the banks 25 was shown, but they can be represented by those of either one bank if address signals of handling bank signals are present within the relevant region. In that case, it would be wise to make a column predecode latch signal YPT₀ or YPT₁, a column select inverted signal YSB₀ or YSB₁ and a switch signal SW₀ or SW₁ on the basis of the signal making a logical sum of a column select signal YS₀ and a column select signal YS₁ and an address related to a bank. According to such a configuration, the number of wiring lines and circuits can be reduced. This holds similarly also in the second and third embodiments.

Besides, a description will be omitted of the configuration of a second column control section 50 ₂ because of a similarity to that of a second column control section 50 ₁ except for the difference in the indices not only of individual components but also of I/O signals.

Besides, as shown in FIG. 1, the peripheral circuit block 22 broadly comprises bank decoders 111 ₁ to 111 ₈ (the bank decoders 111 ₃ to 111 ₉ are omitted in illustration), enable circuits 112 ₁ to 112 ₉ (the enable circuits 112 ₃ to 112 ₈ are omitted in illustration), a controller 113, a data I/O circuit 114 ₁ and data I/O buses 115 ₁ and 115 ₂.

If the corresponding banks 25 ₁ to 25 ₈ are selected, the bank decoders 111 ₁ to 111 ₈, provided corresponding to banks 25 ₁ to 25 ₈, decode the bank select signals BS₀ to BS₂ (e.g., n=0 to 2 for k=0 to 15) produced from address signals A₀ to A_(k) (e.g., k=0 to 15) externally supplied and the inverted signals /BS₀ to /BS₂ of the bank select signals BS₀ to BS₂ to output the select decision signals SD₀ to SD₇ indicating the purport thereof. On the basis of the select decision signals SD₀ to SD₇ outputted from the corresponding bank decoders 111 ₁ to 111 ₈, the enable circuits 112 ₁ to 112 ₈, provided corresponding to the banks 25 ₁ to 25 ₈, produce and output enable signals PN₀ to PN₇ for activating the corresponding banks 25 ₁ to 25 ₈. The controller 113 with a mode register to be reset by using a mode register reset signal MRS in which various information items externally supplied are retained temporarily produces column release signals YR₀ to YR₇ (indices correspond to the banks 25 ₁ to 25 ₈) defining the occurrence timing of various signals or the like in accordance with the internal clock having a definite delay amount synchronous with an external clock.

The data I/O circuit 114 ₁, provided in common with the bank 25 ₁ and 25 ₂, supplies the data inputted from the data I/O terminal DQ₀ (indices take 0 to 3 corresponding to the bank blocks 23 ₁ to 23 ₄) via the I/O buses 115 ₁ and 115 ₂ to the I/O amplifiers 28 ₁ and 28 ₂ and moreover successively outputs data, supplied via the data I/O buses 115 ₁ and 115 ₂ from the I/O amplifiers 28 ₁ and 28 ₂, from the data I/O terminal DQ₀. Incidentally, other than the above shape, the connection relation between the multi-bit composed data I/O terminal DQ₀ and the data I/O terminals 115 ₁ and 115 ₂ and the connection relation between the data I/O buses 115 ₁ and 115 ₂ and the data I/O circuit 114 ₁ may assume various shapes corresponding to different configurations of a memory array 31 and/or global I/O lines 26 ₁ but a description thereof will be omitted because of no direct relation to this embodiment.

Next, the operation of a semiconductor storage unit as configured above will be described referring to the timing charts shown in FIGS. 7 to 10. First of all, the data write operation into the bank 25 ₁ and the data readout operation from the bank 25 ₂ with a time lag between an access to the bank 25 ₁ and an access to the bank 25 ₂ (referred to as gap) will be described referring to the timing chart shown in FIGS. 7 and 8.

When a write command WR (See FIG. 7 (1)) and address signals A₀ to A₁₅ for the write of data supplied externally from a CPU (Central Processing Unit), a memory control unit (any of them is omitted in illustration) or the like are taken in synchronously with the leading of a first cycle in the clock CLK, internal address signals YP₀ to YP₁₂ (See FIG. 7 (3)), bank select signals BS₀ to BS₂ for selecting the bank 25 ₁ and an internal command signal RWCMD (See FIG. 7 (4)) are produced. Henceforth, letting the first cycle be a cycle with the leading edge of a clock CLK taken at the origin in which this write command WR is inputted, a description will be made. Thereby, since the bank decoder 111 ₁ decodes bank select signals BS₀ to BS₂ and the inverted signals /BS₀ to /BS₂ thereof to output a select decision signal SD₀ indicating the gist that the corresponding banks 25 ₁ are selected (not shown in FIG. 7), the enable circuit 112, produces an enable signal PN₀ for activating the corresponding bank 25 ₁ on the basis of the select decision signal SD₀ outputted from the corresponding bank decoder 111 ₁ and outputs it synchronously with the internal command signal.

RWCMD (See FIG. 7 (4)) supplied synchronous with the leading of a third cycle (See FIG. 7 (2)) in the clock CLK (See FIG. 7 (5)). Incidentally, this holds true similarly also for the leading of the first cycle as conventionally. Thus, in the bank selective circuit 29 ₁, a column select signal YS₀ is outputted from the buffer 43 ₁ (See FIG. 7 (7)) and moreover a column multi-select delay signal YMD₀ is outputted from the buffer 47 ₁ after the lapse of a predetermined time (See FIG. 7 (9)). Besides, the controller 113 produces a column release signal YR₀, a write burst signal WBT₀ or the like. Incidentally, to simplify the description in this embodiment, other control signals, input signals, circuits and so on not directly associated to this embodiment are omitted, so that only the enable circuit 112 and the controller 113 are shown.

On the other hand, since data supplied externally and inputted through the data I/O terminal DQ₀ are supplied to the I/O amplifier 28 ₁ or 28 ₂ via the data I/O bus 115 ₁ or 115 ₂ by the data I/O circuit 114 ₁, a write amplifier configuring an I/O amplifier 28 ₁ or 28 ₂, or the like is activated by a column multi-select delay signal YMD₀ (See FIG. 7 (9)) supplied from the bank selective circuit 29 ₁ to amplify data supplied via the data I/O bus 115 ₁ or 115 ₂ from the data I/O circuit 114 ₁ then conveying them to the global I/O line 26 ₁ or 26 ₂. Besides, on the basis of an “H” level write burst signal WBT₀ and a column release signal YR₀ (See FIG. 8 (1)), for example, supplied from the controller 113, the first column control section 49 ₁ produces a column release delay inverted signal YRD₀ (See FIG. 8 (3)), a column release rear signal YRR₀ (See FIG. 8 (7)) and a column release front signal YRF₀ (See FIG. 8 (6)). Incidentally, since the write burst signal WBT₀ is a “H” level, the column release center signal YRC₀ remains a “L” level and does not become a wave form as shown in FIG. 8 (9). It is at the time of data readout that the column release center signal YRC₀ becomes a wave form as shown in FIG. 8 (9).

Thereby, in the second column control section 50 ₁, the column select signal YS₀ supplied from the bank selective circuit 29 ₁ is latched by a column release delay inverted signal YRD₀, a switch signal SW₀ is outputted and moreover the column select inverted signal YSB₀ for inactivating a plurality of column decoders configuring the column decoder group 35 ₁ or 35 ₂ is released on the basis of the column release front signal YRF₀, whereas a column predecode latch signal YPT₀ for activating a plurality of column decoder configuring the column decoder group 35 ₁ or 35 ₂ is produced. Incidentally, since the column release center signal YRC₀ remains a “L” level, the precharge global signal PG₀ remains an “H” level.

Thus, on the basis of a switch signal SW₀, the bank 25 ₁ is selected and the global I/O line 26 ₁ or 26 ₂ is connected to the respective local I/O lines 34 ₁ to 34 ₈ perpendicular thereto, while signals predecoded by use of a predecoder configuring the column decoder group 35 ₁ or 35 ₂ are decoded on the basis of a column select signal YS₀ by use of a main decoder configuring the column decoder group 35 ₁ or 35 ₂ and become outputs of column select switches. Assuming here that these column select switches, for example, CSL₁₀ to CSL₁₃ are successively selected, sense amplifiers 33 of the corresponding bit lines are selected (See FIG. 7 (10)). Thereby, the data conveyed on the global I/O line 26 ₁ or 26 ₂ are conveyed to the selected memory cell of the memory cell array 31 ₁ via any of the local I/O lines 34 ₁ to 34 ₈.

Incidentally, the operation of a word driver 32 ₁ and a row decoder group 48 ₁ are not directly associated with this embodiment, so that a description thereof will be omitted.

By use of the operation described above, data are written into the selected memory cell of the bank 25 ₁.

Subsequently, when synchronously with the leading of the eighth period of a clock CLK (See FIG. 7 (2)), a read command RD (See FIG. 7 (1)) and address signals A₀ to A₁₅ for the readout of data supplied externally are taken in, internal address signals YP₀ to YP₁₂ (See FIG. 7 (3)), bank select signals BS₀ to BS₂ for selecting the bank 25 ₂ and an internal command signal RWCMD (See FIG. 7 (4)) are produced. Thereby, since the bank decoder 111 ₂ decodes bank select signals BS₀ to BS₂ and the inverted signals /BS₀ to /BS₂ thereof to output a select decision signal SD₀ indicating the gist that the corresponding banks 25 ₂ are selected (not shown in FIG. 7), the enable circuit 112 ₂ produces an enable signal PN₁ for activating the corresponding bank 25 ₂ on the basis of the select decision signal SD₁ outputted from the corresponding bank decoder 111 ₂ and outputs it synchronously with the internal command signal RWCMD (See FIG. 7 (4)) supplied synchronous with the leading of an eighth cycle (See FIG. 7 (2)) in the clock CLK (See FIG. 7 (6)).

Thus, in the bank selective circuit 29 ₁, a column select signal YS₁ is outputted from the buffer 44 ₁ (See FIG. 7 (8)) and moreover a column multi-select delay signal YMD₀ is outputted from the buffer 47 ₁ after the lapse of a predetermined time (See FIG. 7 (9)). Besides, the controller 113 produces a column release signal YR₀, a write burst signal WBT₀ or the like.

On the other hand, on the basis of an “L” level write burst signal WBT₀ and a column release signal YR₀, for example, supplied from the controller 113, the first column control section 49 ₁ produces a column release delay inverted signal YRD₀, a column release rear signal YRR₀, a column release front signal YRF₀ and a column release center signal YRC₀. Thereby, in the second column control section 50 ₁, the column select signal YS₁ supplied from the bank selective circuit 29 ₁ is latched by a column release delay inverted signal YRD₀, a switch signal SW₁ is outputted and moreover the column select inverted signal YSB₀ is released on the basis of the column release front signal YRF₀, whereas a column predecode latch signal YPT₀ is produced and further a precharge global signal PG₀ becoming only by one shot, e.g. an “L” level is produced.

Thus, on the basis of a switch signal SW₁, the bank 25 ₂ is selected and the global I/O line 26 ₁ or 26 ₂ is connected to the respective local I/O lines 34 ₁ to 34 ₈ perpendicular thereto, but the global I/O line 26 ₁ or 26 ₂ is short-circuited by means of the precharge global I/O circuit 36 ₁ or 36 ₂ only during the period of the precharge global signal PG₀ becoming an “L” level to set the global I/O line 26 ₁ or 26 ₂ to the precharge state. Besides, on the basis of a column select signal YS₀, signals predecoded by use of a predecoder configuring the column decoder group 35 ₁ or 35 ₂ are decoded by use of a main decoder configuring the column decoder group 35 ₁ or 35 ₂ and become outputs of column select switches. Assuming here that these column select switches, for example, CSL₂₀ and CSL₂₁ are successively selected, sense amplifiers 33 ₃ or 33 ₄ of the corresponding bit lines are selected (See FIG. 7 (11)). Thereby, the sense amplifier 33 ₃ or 33 ₄ detects and amplifies the data read out onto a bit line from the memory cell connected to the selected row of the memory cell array 31 ₂, so that the detected or amplified data are conveyed to the I/O amplifier 28 ₁ or 28 ₂ via the local I/O lines 34 ₅ to 34 ₈ and the global I/O lines 26 ₁ or 26 ₂. Activated by the column multi-select delay signal YMD₀ (See FIG. 7 (9)) supplied from the bank selective circuit 29 ₁, data amplifier configuring the I/O amplifier 28 ₁ or 28 ₂, or the like conveys the supplied data to the data I/O circuit 114 ₁ via the data I/O bus 115 ₁ or 115 ₂ after amplified. Thus, the data I/O circuit 114 ₁ successively outputs the supplied data through the data I/O terminal DQ₀.

Incidentally, the operation of a word driver 32 ₂ and a row decoder group 48 ₂ are not directly associated with this embodiment, so that a description thereof will be omitted.

By use of the operation described above, data are read out from the selected memory cell of the bank 25 ₂.

Next, referring to the timing chart shown in FIGS. 9 and 10, a description will be made of the continuous readout operation of data from the banks 25 ₁ and 25 ₂ without a gap between an access to the bank 25 ₁ and an access to the bank 25 ₂. The basic operation is similar to that of the above presence case of a gap. As shown in FIG. 9 (9) and FIG. 10 (3), however, the absence of a gap allows a column multi-select delay signal YMD₀ to be kept active continuously. Incidentally, in FIG. 9 (9), the time of switchover is designated with a mark to clearly understand the switching from an access to the bank 25 ₁ over to an access to the bank 25 ₂, but the signal actually keeps continuous.

When a read command RD is continuous and data are successively read out from the bank 25, and the 25 ₂ as shown in FIG. 9 (1), an insufficient short-circuiting of a pair of global I/O lines 26 ₁ or 26 ₂ originating in a skew lag or the like occurring at the switching from an access to the bank 25 ₁ over to an access to the bank 25 ₂ in response to a switch signal SW₀ or SW₁ makes difficult a speedy readout of data from a memory cell and being amplified by any of the sense amplifiers 33 ₁ to 33 ₄.

Accordingly, as shown in FIGS. 10 (9), (12) and (13), Embodiment 1 permits a short-circuiting of a pair of global I/O lines 26 ₂ and 26 ₂ to be fully fulfilled by the switchover from a switch signal SW₀ to a switch signal SW₁ during the period of a precharge global signal PG₀ being an “L” level.

Like this, according to this embodiment, the global I/O lines 26 ₁ and 26 ₂ are provided in common with the banks 25 ₁ and 25 ₂ disposed top-to-bottom and moreover the bank selective circuit 29 ₁ is so arranged as to produce a column multi-select delay signal YMS₀ from the signal making a logical sum of the enable signals PN₀ and PN₁, thereby enabling the number of wiring lines to be reduced in compare with Embodiment 1 of producing column multi-select delay signals YMD₀ for each bank.

Besides, according to this embodiment, a short-circuiting of a pair of global I/O lines 26 ₁ or 26 ₂ is fully fulfilled by the switchover from a switch signal SW₀ to a switch signal SW₁ during the period of a precharge global signal PG₀ being an “L” level, in case of a continuous read command RD and a continuous readout of data from the banks 25 ₁ and 25 ₂, thereby enabling the readout of data to be executed at high speed.

B. Embodiment 2

Then, Embodiment 2 will be described. FIG. 11 is a block diagram showing the electric configuration of the main part of a semiconductor storage unit according to Embodiment 2. In FIG. 11, like symbols are attached to parts corresponding to individual parts of FIG. 1 and a description thereof will be omitted. With the semiconductor storage unit shown in FIG. 11, a bank block 121 ₁ is anew provided in place of the bank block 23 ₁ shown in FIG. 1. Incidentally, in a semiconductor storage unit according to Embodiment 2, the configuration of a functional block 21 ₁ except the bank blocks 121 ₁ and 121 ₂ (unshown but the same configuration except for the difference in indices of the bank block 121 ₁ and individual components and moreover the difference in indices of inputted/outputted signals and data) is much the same as that of the functional block 21 ₁ shown in FIG. 2 (1). As with Embodiment 1, the chip layout also comprises four bank blocks as shown in FIG. 2 (2). With respect to the second column control section 50 ₁, however, since the bank select circuit 122 ₁ produces only a column multi-select signal YMS₀ in place of column select signals YS₀ and YS₁ as mentioned above, the components related to a column select signal YS₀ are correspondingly applied to those related to a column multi-select signal YMS₀ as they are among the circuit shown in FIG. 6, but those related to a column multi-select signal YS₁ are unnecessary and eliminated.

The bank block 121 ₁ differs from the bank block 23 ₁ shown in FIG. 1 in that a bank select circuit 122 ₁ is anew provided in place of the bank select circuit 291. Here, FIG. 12 is a block diagram showing one configurational example of bank select circuit 122 ₁. In FIG. 12, like symbols are attached to those corresponding to individual parts of FIG. 4 and a description thereof will be omitted. The bank select circuit 122 ₁ differs from the bank select circuit 29 ₁ in that a buffer 123 ₁ for buffering an output signal of the OR gate 45 ₁ to output it as column multi-select signal YMS₀ is anew provided in place of buffers 43 ₁ and 44 ₁.

Next, the operation of a semiconductor storage unit as configured above will be described referring to FIGS. 13 and 14. First of all, the write operation of data into the bank 25 ₁ and the readout operation of data from the bank 25 ₂ with a gap between an access to the bank 25 ₁ and an access to the bank 25 ₂ will be described referring to a timing charts FIG. 13.

When a write command WR (See FIG. 13 (2)) and address signals AO to A₁₅ for the write of data supplied externally are taken in synchronously with the leading (See FIG. 13 (2)) of a first cycle in the clock CLK, internal address signals YP₀ to YP₁₂ (See FIG. 13 (3)), bank select signals BS₀ to BS₂ for selecting the bank 25 ₁ and an internal command signal RWCMD (See FIG. 13 (4)) are produced. Henceforth, letting the cycle with the leading edge of a clock CLK when this write command WR was inputted taken at the origin be a first cycle, a description will be made. Thereby, since the bank decoder 111 ₂ decodes bank selection signals BS₀ to BS₂ and the inverted signals IBS₀ to /BS₂ thereof to output a select decision signal SD₀ (not shown in FIG. 13), the enable circuit 112 ₁ produces an enable signal PN₀ on the basis of the select decision signal SD₀ outputted from the corresponding bank decoder 111 ₁ and outputs it synchronously with the internal command signal RWCMD (See FIG. 13 (4)) supplied synchronously with the leading of a third cycle (See FIG. 13 (2)) in the clock CLK (See FIG. 13 (5)). Incidentally, this holds true similarly also for the leading of the first cycle as conventionally. Thus, in the bank select circuit 122 ₁, a column multi-select signal YMS₀ is outputted from the buffer 123 ₁ (See FIG. 13 (7)) and moreover a column multi-select delay signal YMD₀ is outputted from the buffer 472 after the lapse of a predetermined time (See FIG. 13 (8)). Besides, the controller 113 produces a column release signal YR₀, a write burst signal WBT₀ or the like. Incidentally, to simplify the description, other control signals, input signals, circuits and so on not directly associated with this embodiment are omitted, so that only the enable circuit 112 and the controller 113 are shown.

On the other hand, since data supplied externally and inputted through the data I/O terminal DQ₀ are supplied to the I/O amplifier 28 ₁ or 28 ₂ via the data I/O bus 115 ₁ or 115 ₂ by the data I/O circuit 114 ₁, a write amplifier configuring an I/O amplifier 28 ₁ or 28 ₂, or the like is activated by a column multi-selection delay signal YMD₀ (See FIG. 13 (8)) supplied from the bank selection circuit 122 ₁ to amplify data supplied via the data I/O bus 115 ₁ or 115 ₂ from the data I/O circuit 114 ₁, then conveying them to the global I/O line 26 ₁ or 26 ₂. Besides, on the basis of an “H” level write burst signal WBT₀ and a column release signal YR₀, for example, supplied from the controller 113, the first column control section 49 ₁ produces a column release delay inverted signal YRD₀, a column release rear signal YRR₀ and a column release front signal YRF₀. Incidentally, since the write burst signal WBT₀ is a “H” level, the column release center signal YRC₀ remains a “L” level.

Thereby, in the second column control section 50 ₁, the column multi-select signal YMS₀ supplied from the bank selection circuit 122 ₁ is latched by a column release delay inverted signal YRD₀, a switch signal SW₀ is outputted and moreover the column selection inverted signal YSB₀ is released on the basis of the column release front signal YRF₀, whereas a column predecode latch signal YPT₀ is produced. Incidentally, since the column release center signal YRC₀ remains a “L” level, the precharge global signal PG₀ remains an “H” level.

Thus, on the basis of a switch signal SW₀ , the bank 25 ₁ is selected and the global I/O line 26 ₁ or 26 ₂ is connected to the respective local I/O lines 34 ₁ to 34 ₈ perpendicular thereto, while signals predecoded by use of a predecoder configuring the column decoder group 35 ₁ or 35 ₂ are decoded on the basis of a column multi-select signal YMS₀ by use of a main decoder configuring the column decoder group 35 ₁ or 35 ₂ and become outputs of column selection switches. Assuming here that these column selection switches, for example, CSL₁₀ to CSL₁₃ are successively selected, sense amplifiers 33 of the corresponding bit lines are selected (See FIG. 13 (9)). Thereby, the data conveyed on the global I/O line 26 ₁ or 26 ₂ are conveyed to the selected memory cell of the memory cell array 31 ₁ via any of the local I/O lines 34 ₁ to 34 ₈.

Incidentally, the operation of a word driver 32 ₁ and a row decoder group 48 ₁ are not directly associated with this embodiment, so that a description thereof will be omitted.

By use of the operation described above, data are written into the selected memory cell of the bank 25 ₁.

Subsequently, when synchronously with the leading of the eighth cycle of a clock CLK (See FIG. 13 (2)), a read command RD (See FIG. 13 (1)) and address signals A₀ to A₁₅ supplied externally are taken in, internal address signals YP₀ to YP₁₂ (See FIG. 13 (3)), bank selection signals BS₀ to BS₂ for selecting the bank 25 ₂ and an internal command signal RWCMD (See FIG. 13 (4)) are produced. Thereby, since the bank decoder 111 ₂ decodes bank selection signals BS₀ to BS₂ and the inverted signals /BS₀ to /BS₂ thereof to output a select decision signal SD₁ (not shown in FIG. 13), the enable circuit 112 ₂ produces an enable signal PN₁ on the basis of the select decision signal SD₁ outputted from the corresponding bank decoder 111 ₂ and outputs it synchronously with the internal command signal RWCMD (See FIG. 13 (4)) supplied synchronous with the leading of an eighth cycle (See FIG. 13 (2)) in the clock CLK (See FIG. 13 (6)).

Thus, in the bank selection circuit 122 ₁, a column multi-select signal YMS₀ is outputted from the buffer 123 ₁ (See FIG. 13 (7)) and moreover a column multi-selection delay signal YMD₀ is outputted from the buffer 47 ₁ after the lapse of a predetermined time (See FIG. 13 (8)). Besides, the controller 113 produces a column release signal YR₀, a write burst signal WBT₀ or the like.

On the other hand, on the basis of an “L” level write burst signal WBT₀ and a column release signal YR₀, for example, supplied from the controller 113, the first column control section 49 ₁ produces a column release delay inverted signal YRD₀, a column release rear signal YRR₀, a column release front signal YRF₀ and a column release center signal YRC₀. Thereby, in the second column control section 50 ₁, the column multi-select signal YMS₀ supplied from the bank selection circuit 122 ₁ is latched by a column release delay inverted signal YRD₀, a switch signal SW₁ is outputted and moreover the column selection inverted signal YSB₀ is released on the basis of the column release front signal YRF₀, whereas a column predecode latch signal YPT₀ is produced and further a precharge global signal PG₀ becoming only by one shot, e.g. an “L” level is produced.

Thus, on the basis of a switch signal SW₁, the bank 25 ₂ is selected and the global I/O line 26 ₁ or 26 ₂ is connected to the respective local I/O lines 34 ₁ to 34 ₈ perpendicular thereto, but the global I/O line 26 ₁ or 26 ₂ is short-circuited by means of the precharge global I/O circuit 36 ₁ or 36 ₂ only during the period of the precharge global signal PG₀ becoming an “L” level to set the global I/O line 26 ₁ or 26 ₂ to the precharge state. Besides, on the basis of a column multi-selection signal YMS₀, signals predecoded by use of a predecoder configuring the column decoder group 35 ₁ or 35 ₂ are decoded by use of a main decoder configuring the column decoder group 35 ₁ or 35 ₂ and become outputs of column selection switches. Assuming here that these column selection switches, for example, CSL₂₀ to CSL₂₁ are successively selected, sense amplifiers 33 of the corresponding bit lines are selected (See FIG. 13 (10)). Thereby, the sense amplifier 33 ₃ or 33 ₄ detects and amplifies the data read out onto a bit line from the memory cell connected to the selected row of the memory cell array 31 ₂, so that the detected or amplified data are conveyed to the I/O amplifier 28 ₁ or 28 ₂ via the local I/O lines 34 ₅ to 34 ₈ and the global I/O line 26 ₁ or 26 ₂. Activated by the column multi-selection delay signal YMD₀ (See FIG. 13 (8)) supplied from the bank selection circuit 122 ₁, data amplifier configuring the I/O amplifier 28 ₁ or 28 ₂, or the like conveys the supplied data to the data I/O circuit 114 ₁ via the data I/O bus 115 ₁ or 115 ₂ after amplified. Thus, the data I/O circuit 114 ₁ successively outputs the supplied data through the data I/O terminal DQ₀.

Incidentally, the operation of a word driver 32 ₂ and a row decoder group 48 ₂ are not directly associated with this embodiment, so that a description thereof will be omitted.

By use of the operation described above, data are read out from the selected memory cell of the bank 25 ₂.

Next, FIG. 14 is a timing chart showing the continuous readout operation of data from the banks 25 ₁ and 25 ₂ without gap between an access to the bank 25 ₁ and an access to the bank 25 ₂. The basic operation is similar to that of the above presence case of a gap. As shown in FIG. 14 (7) and FIG. 14 (8),however, the absence of a gap allows a column multi-select signal YMS₀ or a column multi-select delay signal YMD₀ to be kept active continuously. Incidentally, in FIG. 14 (7) and (8), the time of switching is designated with a mark to clearly understand the switching from an access to the bank 25 ₁ over to an access to the bank 25 ₂, but the signal keeps continuous in fact.

Like this, according to this embodiment, since the global I/O lines 26 ₁ and 26 ₂ are provided in common with the banks 25 ₁ and 25 ₂ disposed top-to-bottom and moreover the bank selection circuit 122 ₁ is so arranged as to produce a column multi-select signal YMS₀ and a column multi-select delay signal YMD₀ from the signal making a logical sum of the enable signals PN₀ and PN₁, the number of wiring lines can be reduced to a greater extent than Embodiment 1 of producing column select signals YS₀ and YS₁ for each bank.

C. Embodiment 3

Then, Embodiment 3 will be described. FIG. 15 is a block diagram showing the electric configuration of the main part of a semiconductor storage unit according to Embodiment 3. In FIG. 15, like symbols are attached to parts corresponding to individual parts of FIG. 11 and a description thereof will be omitted. With the semiconductor storage unit shown in FIG. 15, a bank block 124 ₁ and a peripheral circuit block 125 are anew provided in place of the bank block 121 ₁ and the peripheral circuit block 22 shown in FIG. 11. Incidentally, in a semiconductor storage unit according to Embodiment 3, the configuration of a functional block 21 ₁ except the bank blocks 124 ₁ and 124 ₂ (unshown but the same configuration except for the difference in indices of individual components from the bank block 124 ₁ as well as the difference in indices of inputted/outputted signals and data) and the peripheral circuit block 125 is much the same as that of the functional block 21, shown in FIG. 2 (1). Besides, as with Embodiments 1 and 2, the chip layout also comprises four bank blocks as shown in FIG. 2 (2). With respect to the second column control section 50 ₁, however, since the bank select circuit 126 ₁ produces only a column multi-select signal YMS₀ in place of column select signals YS₀ and YS₁ as mentioned later, the components related to a column select signal YS₀ are correspondingly applied to those related to a column multi-select signal YMS₀ as they are among the circuit shown in FIG. 6, but those related to a column select signal YS₁ are unnecessary and eliminated.

The bank block 124 ₁ differs from the bank block 121 ₁ shown in FIG. 11 in that a bank select circuit 126 ₁ is anew provided in place of the bank select circuit 122 ₁. Here, FIG. 16 is a block diagram showing one configurational example of bank select circuit 126 ₁. In FIG. 16, like symbols are attached to those corresponding to individual parts of FIG. 12 and a description thereof will be omitted. The bank select circuit 126 ₁ differs from the bank select circuit 122 ₁ in that the OR gate 45 ₁ is eliminated and an enable signal PN₀ is directly inputted to the buffer 123 ₁ and the delay element 46 ₁.

The peripheral circuit block 125 differs from the peripheral circuit 22 shown in FIG. 11 in that four bank decoders 127 ₁ to 127 ₄ (bank decoders 127 ₃ and 127 ₄ are omitted in illustration) are anew provided in place of eight bank decoders 111 ₁ to 111 ₈ and in that four enable circuits 112 ₅ to 112 ₈ are eliminated out of the eight enable circuits 112 ₁ to 112 ₈. The bank decoders 127 ₁ to 127 ₄, provided corresponding to the bank blocks 23 ₁ to 23 ₄, decodes bank select signals BS₁ and BS₂ and the inverted signals /BS₁ and /BS₂ thereof and outputs select decision signals SD₀ to SD₃ indicating its gist if the corresponding bank blocks 23 ₁ to 23 ₄ are selected. The enable circuits 112 ₁ to 112 ₄, corresponding to the bank blocks 23 ₁ to 23 ₄, produce and output enable signals PN₀ to PN₃ for activating the corresponding bank blocks 23 ₁ to 23 ₄, on the basis of select decision signals SD₀ to SD₄ issued from the corresponding bank decoders 127 ₁ to 127 ₄.

Next, the operation of a semiconductor storage unit as configured above will be described referring to timing charts shown in FIGS. 17 and 18. First of all, the write operation of data into the bank 25 ₁ and the readout operation of data from the bank 25 ₂ with a gap between an access to the bank 25 ₁ and an access to the bank 25 ₂ will be described referring to the timing chart of FIG. 17.

When a write command WR (See FIG. 17 (1)) and address signals A₀ to A₁₅ supplied externally are taken in synchronously with the leading (See FIG. 17 (2)) of a first cycle in the clock CLK, internal address signals YP₀ to YP₁₂ (See FIG. 17 (3)), bank select signals BS₀ to BS₂ for selecting the bank 25 ₁ and an internal command signal RWCMD (See FIG. 17 (4)) are produced. Henceforth, letting the cycle with the leading edge of a clock CLK when this write command WR was inputted taken at the origin be a first cycle, a description will be made. Thereby, since the bank decoder 127 ₁ decodes the bits BS₁ and BS₂ except the least significant bit BS₀ out of bank select signals BS₀ to BS₂ and the inverted signals /BS₀ to /BS₂ of the bank select signals BS₁ and BS₂ to output select decision signal SD₀ indicating a gist that the corresponding bank block 23 ₁ is selected (not shown in FIG. 17), the enable circuit 112 ₁ produces an enable signal PN₀ for activating the corresponding bank block 23 ₁ on the basis of the select decision signal SD₀ outputted from the corresponding bank decoder 127 ₁ and outputs it synchronously with the internal command signal RWCMD (See FIG. 17 (4)) supplied synchronously with the leading of the third cycle (See FIG. 17 (2)) in the clock CLK (See FIG. 17 (5)). Incidentally, this holds true similarly also for the leading of the first cycle as conventionally. Thus, in the bank select circuit 126 ₁, a column multi-select signal YMS₀ is outputted from the buffer 123 ₁ (See FIG. 17 (6)) and moreover a column multi-select delay signal YMD₀ is outputted from the buffer 47 ₁ after the lapse of a predetermined time (See FIG. 17 (7)). Besides, the controller 113 produces a column release signal YR₀, a write burst signal WBT₀ or the like. Incidentally, to simplify the description, other control signals, input signals, circuits and so on not directly associated with this embodiment are omitted, so that only the enable circuit 112 and the controller 113 are shown.

On the other hand, since data supplied externally and inputted through the data I/O terminal DQ₀ are supplied to the I/O amplifier 28 ₁ or 28 ₂ via the data I/O bus 115 or 115 ₂ by the data I/O circuit 114 ₁, a write amplifier configuring an I/O amplifier 28 ₁ or 28 ₂, or the like is activated by a column multi-selection delay signal YMD₀ (See FIG. 17 (7)) supplied from the bank selection circuit 126 ₁ to amplify data supplied via the data I/O bus 115 ₁ or 115 ₂ from the data I/O circuit 114 ₁, then conveying them to the global I/O line 26 ₁ or 26 ₂. Besides, on the basis of an “H” level write burst signal WBT₀ and a column release signal YR₀, for example, supplied from the controller 113, the first column control section 49 ₁ produces a column release delay inverted signal YRD₀, a column release rear signal YRR₀ and a column release front signal YRF₀. Incidentally, since the write burst signal WBT₀ is a “H” level, the column release center signal YRC₀ remains a “L” level.

Thereby, in the second column control section 501 ₁ the column multi-select signal YMS₀ supplied from the bank selection circuit 126 ₁ is latched by a column release delay inverted signal YRD₀, a switch signal SW₀ is outputted and moreover the column selection inverted signal YSB₀ is released on the basis of the column release front signal YRF₀, whereas a column predecode latch signal YPT₀ is produced. Incidentally, since the column release center signal YRC₀ remains a “L” level, the precharge global signal PG₀ remains an “H” level.

Thus, on the basis of a switch signal SW₀, the bank 25 ₁ is selected and the global I/O line 26 ₁ or 26 ₂ is connected to the respective local I/O lines 34 ₁ to 34 ₈ perpendicular thereto, while signals predecoded by use of a predecoder configuring the column decoder group 35 ₁ or 35 ₂ are decoded on the basis of a column multi-select signal YMS₀ by use of a main decoder configuring the column decoder group 35 ₁ or 35 ₂ and become outputs of column selection switches. Assuming here that these column selection switches, for example, CSL₁₀ to CSL₁₃ are successively selected, sense amplifiers 33 of the corresponding bit lines are selected (See FIG. 17 (8)).

Thereby, the data conveyed on the global I/O line 26 ₁ or 26 ₂ are conveyed to the selected memory cell of the memory cell array 31 ₁ via any of the local I/O lines 34 ₁ to 34 ₈.

Incidentally, the operation of a word driver 32 ₁ and a row decoder group 48 ₁ are not directly associated with this embodiment, so that a description thereof will be omitted.

By use of the operation described above, data are written into the selected memory cell of the bank 25 ₁.

Subsequently, when synchronously with the leading of the eighth cycle of a clock CLK (See FIG. 17 (2)), a read command RD (See FIG. 17 (1)) and address signals A₀ to A₁₅. supplied externally are taken in, internal address signals YP₀ to YP₁₂ (See FIG. 17 (3)), bank selection signals BS₀ to BS₂ for selecting the bank 25 ₂ and an internal command signal RWCMD (See FIG. 17 (4)) are produced. Thereby, since the bank decoder 127 ₁ decodes the other bits BS₁ and BS₂ than the least significant bit BS₀ out of bank selection signals BS₀ to BS₂ and the inverted signals /BS₁ to /BS₂ thereof to output a select decision signal SD₀ indicating a gist that the corresponding bank block 23 ₁ is selected (not shown in FIG. 17), the enable circuit 112 ₂ produces an enable signal PN₀ on the basis of the select decision signal SD₀ outputted from the corresponding bank decoder 127 ₂ and outputs it synchronously with the internal command signal RWCMD (See FIG. 17 (4)) supplied synchronously with the leading of an eighth cycle (See FIG. 17 (2)) in the clock CLK (See FIG. 17 (5)). Thus, in the bank selection circuit 126 ₁, a column multi-select signal YMS₀ is outputted from the buffer 123 ₁ (See FIG. 17 (6)) and moreover a column multi-selection delay signal YMD₀ is outputted from the buffer 123 ₁ after the lapse of a predetermined time (See FIG. 17 (7)). Besides, the controller 113 produces a column release signal YR₀, a write burst signal WBT₀ or the like.

On the other hand, on the basis of an “L” level write burst signal WBT₀ and a column release signal YR₀, for example, supplied from the controller 113, the first column control section 49 ₁ produces a column release delay inverted signal YRD₀, a column release rear signal YRR₀, a column release front signal YRF₀ and a column release center signal YRC₀. Thereby, in the second column control section 50 ₁, the column multi-select signal YMS₀ supplied from the bank selection circuit 126 ₁ is latched by a column release delay inverted signal YRD₀, a switch signal SW₀ is outputted and moreover the column selection inverted signal YSB₀ is released on the basis of the column release front signal YRF₀, whereas a column predecode latch signal YPT₀ is produced and further a precharge global signal PG₀ becoming only by one shot, e.g. an “L” level is produced.

Thus, on the basis of a switch signal SW₁, the bank 25 ₂ is selected and the global I/O line 26 ₁ or 26 ₂ is connected to the respective local I/O lines 34 ₁ to 34 ₈ perpendicular thereto, but the global I/O line 26 ₁ or 26 ₂ is short-circuited by means of the precharge global I/O circuit 36 ₁ or 36 ₂ only during the period of the precharge global signal PG₀ becoming an “L” level to set the global I/O line 26 ₁ or 26 ₂ to the precharge state. Besides, on the basis of a column multi-selection signal YMS₀, signals predecoded by use of a predecoder configuring the column decoder group 35 ₁ or 35 ₂ are decoded by use of a main decoder configuring the column decoder group 35 ₁ or 35 ₂ and become outputs of column selection switches. Assuming here that these column selection switches, for example, CSL₂₀ to CSL₂₁ are successively selected, sense amplifiers 33 of the corresponding bit lines are selected (See FIG. 17 (9)). Thereby, the sense amplifier 33 ₃ or 33 ₄ detects and amplifies the data read out onto a bit line from the memory cell connected to the selected row of the memory cell array 31 ₂, so that the detected or amplified data are conveyed to the I/O amplifier 28 ₁ or 28 ₂ via the local I/O lines 345 to 348 and the global I/O line 26 ₁ or 26 ₂. Activated by the column multi-selection delay signal YMD₀ (See FIG. 17 (7)) supplied from the bank select circuit 126 ₁, data amplifier configuring the I/O amplifier 28 ₁ or 28 ₂, or the like conveys the supplied data to the data I/O circuit 114 ₁ via the data I/O bus 115 ₁ or 115 ₂ after amplified. Thus, the data I/O circuit 114 ₁ successively outputs the supplied data through the data I/O terminal DQ₀.

Incidentally, the operation of a word driver 32 ₂ and a row decoder group 482 are not directly associated with this embodiment, so that a description thereof will be omitted.

By use of the operation described above, data are read out from the selected memory cell of the bank 25 ₂.

Next, FIG. 18 is a timing chart showing the continuous readout operation of data from the banks 25 ₁ and 25 ₂ without a gap between an access to the bank 25 ₁ and an access to the bank 25 ₂. The basic operation is similar to that of the above presence case of a gap. As shown in FIGS. 18 (5) to (7), Li; however, the absence of a gap allows an enable signal PN₀ a column multi-select signal YMS₀ or a column multi-select delay signal YMD₀ to be kept active continuously. Incidentally, in FIG. 18 (5) to (7), the time of switching is designated with a mark to clearly understand the switching from an access to the bank 25 ₁ over to an access to the bank 25 ₂, but the signal keeps active in fact.

Like this, according to this embodiment, since the global I/O lines 26 ₁ and 26 ₂ are provided in common with the banks 25 ₁ and 25 ₂ disposed top-to-bottom and moreover the bank selection circuit 126 ₁ is so arranged as to produce a column multi-select signal YMS₀ and a column multi-select delay signal YMD₀ from the enable signal PN₀ for activating the bank block 23 ₁, the number of wiring lines can be reduced to a greater extent than Embodiment 2 of producing enable signals PN₀ and PN₁ for each bank and moreover the number of bank decoders 127 and enable circuits 112 can be also reduced by half.

D. Embodiment 4

Then, Embodiment 4 will be described. FIG. 19 is a block diagram showing the electric configuration of the main part of a semiconductor storage unit according to Embodiment 4. In FIG. 19, like symbols are attached to parts corresponding to individual parts of FIG. 11 and a description thereof will be omitted.

With the semiconductor storage unit shown in FIG. 19, a bank block 131, is anew provided in place of the bank block 121 ₁ shown in FIG. 11. Incidentally, in a semiconductor storage unit according to Embodiment 4, the configuration of the functional blocks 21 ₁ except for the bank block 131 ₁ and the bank block 131 ₂ (unshown but the same configuration except for a difference in indices of individual components from the bank block 131 ₁ as well as a difference in indices of inputted/outputted signals and data) is much the same as that of the functional block 21 ₁ shown in FIG. 2 (1). Besides, as with Embodiments 1 to 3, the chip layout also comprises four bank blocks as shown in FIG. 2 (2). With respect to the second column control section 50 ₁, however, since the bank select circuit 132, produces only a column multi-select signal YMS₀ in place of column select signals YS₀ and YS₁ as mentioned later, the components related to a column select signal YS₀ are correspondingly applied to those related to a column multi-select signal YMS₀ as they are among the circuit shown in FIG. 6, but those related to a column select signal YS₁ are unnecessary and eliminated.

The bank block 131 ₁ differs from the bank block 121 ₁ shown in FIG. 11 in that a bank select circuit 132 ₁ is anew provided in place of the bank select circuit 122 ₁. Here, FIG. 20 is a block diagram showing one configurational example of bank select circuit 132 ₁. In FIG. 20, like symbols are attached to those corresponding to individual parts of FIG. 12 and a description thereof will be omitted. The bank select circuit 132 ₁ differs from the bank select circuit 122 ₁ in that an AND gate 133 ₁ for making a logical product of an internal address signal /YP₀ and a column multi-select signal YMS₀, as an output signal of the buffer 123 ₁ to output the resultant as a column multi-select signal YMSP₀, an AND gate 134 ₁ for making a logical product of an internal address signal YP₀ and a column multi-select signal YMS₀ to output the resultant as a column multi-select signal YMSP₁, an AND gate 135 ₁ for making a logical product of an internal address signal/YP₀ and a column multi-select delay signal YMD₀, as an output signal of the buffer 47 ₁ to output the resultant as a column multi-select delay signal YMDP₀ and an AND gate 136 ₁ for making a logical product of an internal address signal YP₀ and a column multi-select delay signal YMD₀ to output the resultant as a column multi-select delay signal YMDP₁ are anew provided. Incidentally, except that the number of precharge global I/O circuits 36 ₁ or 36 ₂ activated by the column multi-select signal YMSP₀ and YMSP₁as well as the column multi-select delay signal YMDP₀ and YMDP₁ are reduced by half, thereby resulting a reduction by half of the number of activated memory cells in the bank 25 ₁ or 25 ₂ relative to that of Embodiment 2, the operation of a semiconductor storage unit as configured above is much the same as with Embodiment 2, so that a description thereof will be omitted.

Like this, according to Embodiment 4, since AND gates 133 ₁, 134 ₁, 135 ₁ and 136 ₁ are provided, logical products of an internal signals /YP₀ and YP₀ with a column multi-select signal YMS₀ or a column multi-select delay signal YMD₀ are made and the results are used as activating signals, the number of memory cells in the banks 25 ₁ and 25 ₂ can be reduced by half as compared with Embodiment 2.

E. Embodiment 5

Then, Embodiment 5 will be described. FIG. 21 is a block diagram showing the electric configuration of the main part of a semiconductor storage unit according to Embodiment 5. In FIG. 21, like symbols are attached to parts corresponding to individual parts of FIG. 15 and a description thereof will be omitted. With the semiconductor storage unit shown in FIG. 21, a bank block 140 ₁ and a peripheral circuit block 141 are anew provided in place of the bank block 124 ₁ and the peripheral circuit block 125 shown in FIG. 15 and further a test circuit 142 ₁ configuring a column control circuit is anew provided along with the first column control section 49 ₁ and the second column control sections 50 ₁ and 50 ₂. Incidentally, in a semiconductor storage unit according to this embodiment, the configuration of the functional block 21 ₁ except for the bank block 140 ₁ and the bank block 140 ₂ (unshown but the same configuration except for a difference in indices of individual components from the bank block 140 ₁ as well as a difference in indices of inputted/outputted signals and data), the peripheral circuit block 141 and the test circuit 142 ₁ is much the same as that of the functional block 21 ₁ shown in FIG. 2 (1). Besides, as with Embodiments 1 to 4, the chip layout also comprises four bank blocks as shown in FIG. 2 (2). With respect to the second column control section 50 ₁, however, since the bank select circuit 143 ₁ produces only a column multi-select signal YMS₀ in place of column select signals YS₀ and YS₁ as mentioned later, the components related to a column select signal YS₀ are correspondingly applied to those related to a column multi-select signal YMS₀ as they are among the circuit shown in FIG. 6, but those related to a column select signal YS₁ are unnecessary and eliminated.

The bank block 140 ₁ differs from the bank block 124 ₁ shown in FIG. 15 in that a bank select circuit 143 ₁ is anew provided in place of the bank select circuit 126 ₁. Here, FIG. 22 is a block diagram showing one configurational example of a bank select circuit 143 ₁. In FIG. 22, like symbols are attached to those corresponding to individual parts of FIG. 16 and a description thereof will be omitted. The bank select circuit 143 ₁ differs from the bank select circuit 126 ₁ in that an OR gate 144 ₁ for making a logical sum of a test signal TS supplied from the controller 153 and an enable signal PN₀ is anew provided and an output signal of the OR gate 144 ₁ is inputted to the buffer 123 ₁ and the delay element 46 ₁.

The peripheral circuit block 141 differs from the peripheral circuit block 125 shown in FIG. 15 in that a controller 145 is anew provided in place of the controller 113. The controller l45 differs from the controller 113 shown in FIG. 15 in producing and outputting also a test signal TS for performing a test such as fault analysis of this semiconductor storage unit.

Next, FIG. 22 shows a block diagram of a configurational example of test circuit 142 ₁. The test circuit 142 ₁ of this example broadly comprises an AND gate 146 ₁ for making a logical product of a test signal TS supplied from the controller 145 configuring the peripheral circuit block 141 and an internal address signal /YP₀, an AND gate 147 ₁ for making a logical product of the test signal TS and an internal address signal YP₀, an invertor 148 ₁ for inverting the test signal TS, an AND gate 149 ₁ for making a logical product of an output signal of the invertor 148 ₁ and a column multi-select signal YMS₀ supplied from the bank select circuit 143 ₁, an OR gate 150 ₁ for making a logical sum of an output signal of the AND gate 146 ₁ and an output signal of the AND gate 149 ₁, an OR gate 151 ₁ for making a logical sum of an output signal of the AND gate 147 ₁ and an output signal of the AND gate 149 ₁, a buffer gate 152 ₁ for buffering an output signal of the OR gate 150 ¹ to output it as a column multi-select signal YMBT₀ and a buffer 153 ₁ for buffering an output signal of the OR gate 151 ₁ to output it as a column multi-select signal YMBT₁.

In such a configuration, since the controller 145 outputs a an “H” level test signal TS on the basis of a test command supplied externally at the time of a test, a column multi-select signal YMS₀ is outputted from the bank select circuit 143 ₁ on the basis of the test signal TS. In this case, when an internal address signal/YP₀ is supplied to test the bank 25 ₁, the AND gate 146 ₁ allows the test signal TS to pass in the test circuit 142 ₁. Thereby, since a column multi-select signal YMBT₀ is outputted from the buffer 152 ₁, a test of the bank 25 ₁ becomes possible. In contrast to this, when an internal address signal YP₀ is supplied to test the bank 25 ₂, the AND gate 147 ₁ allows the test signal TS to pass in the test circuit 142 ₁. Thereby, since a column multi-select signal YMBT₁ is outputted from the buffer 153 ₁, a test of the bank 25 ₂ becomes possible.

On the other hand, at a normal time, since the controller 145 outputs an “L” level test signal TS, the AND gate 149 ₁ always allows the column multi-select signal YMS₀ to pass in the test circuit 142 ₁. Thereby, a column multi-select signal YMBT₀ and a column multi-select signal YMBT₁ are outputted from the buffers 152 ₁ and 153 ₁. The subsequent operation is almost similar to that of a semiconductor storage unit according to Embodiment 3, so that a description thereof will be omitted.

As described above, in a large capacity semiconductor storage unit, a test mode for writing data at a time or reading data at a time into/from a plurality of banks is provided to shorten the time of a fault analysis or an estimate test and there is a case of supplying a test signal to a semiconductor storage unit for this purpose. In a semiconductor storage unit with global I/O lines 26 ₁ and 26 ₂ provided in common with the upper and lower banks 25 ₁ and 25 ₂, only the bank 25 selected by use of the bank select signals BS₀ to BS₂ is activated in an ordinary use mode, but since the upper and lower banks 25 ₁ and 25 ₂ are simultaneously excited in a conventional test mode when a test mode is supplied as it is, data read from individual banks 25 ₁ and 25 ₂ collide with each other in the global I/O line 26 ₁ or 26 ₂, thus disabling a test to be normally carried out.

Under these circumstances, by an arrangement that a test signal is produced in the controller 145 and moreover only either of a column multi-select signal YMBT₀ or a column multi-select signal YMBT₁ is outputted on the basis of an internal address signal /YP₀ or an internal address signal YP₀ in the test circuit 142 ₁ as seen in this example, only either of the bank 25 ₁ or the bank 25 ₂ configuring the bank block 140 ₁ is activated. Thus, the collision of data read out from individual banks 25 ₁ and 25 ₂ on the global I/O line 26 ₁ or 26 ₂ can be avoided.

F. Embodiment 6

Then, Embodiment 6 will be described. FIG. 24 is a block diagram showing the electric configuration of the main part of a semiconductor storage unit according to Embodiment 6. In FIG. 24, like symbols are attached to parts corresponding to individual parts of FIG. 1 and a description thereof will be omitted. With the semiconductor storage unit shown in FIG. 24, a bank block 154 ₁ and a peripheral circuit block 155 are anew provided in place of the bank block 23, and the peripheral circuit block 22 shown in FIG. 1. Incidentally, in a semiconductor storage unit according to this embodiment, other constituents of the functional block 21 ₁ than the bank block 154 ₁ and the bank block 154 ₂ (unshown but the same configuration except for a difference in indices of individual components from the bank block 154 ₁ as well as a difference in indices of inputted/outputted signals and data) and the peripheral circuit block 155 ₁ are much the same as those of the functional block 21 ₁ shown in FIG. 2 (1). Besides, as with Embodiments 1 to 5, the chip layout also comprises four bank blocks as shown in FIG. 2 (2).

The bank block 154 ₁ differs from the bank block 23 ₁ shown in FIG. 1 in that a bank select circuit 156 ₁ is anew provided in place of the bank select circuit 29 ₁. Here, FIG. 25 is a block diagram showing one configurational example of bank select circuit 156 ₁. In FIG. 25, like symbols are attached to those corresponding to individual parts of FIG. 4 and a description thereof will be omitted. The bank select circuit 156 ₁ differs from the bank select circuit 29 ₁ shown in FIG. 4 in that an AND gate 158 ₁ for making a logical product of a test signal TS and an internal address signal/YP₀, an AND gate 159 ₁ for making a logical product of a test signal TS and an internal address signal YP₀, an OR gate 160 ₁ for making a logical sum of an output signal of the AND gate 158 ₁ and an enable signal PN₀ and an OR gate 161 ₁ for making a logical sum of an output signal of the AND gate 159 ₁ and an enable signal PN₁ are anew provided and in that an output signal of the OR gate 160 ₁ is inputted to the input terminal of the buffer 43 ₁ and one of input terminal of the OR gate 45 ₁ and an output signal of the OR gate 161 ₁ is inputted to the input of the buffer 44 ₁ and the other of input terminal of the OR gate 45 ₁.

Besides, the peripheral circuit block 155 shown in FIG. 24 differs from the peripheral circuit block 22 shown in FIG. 1 in that a controller 157 is anew provided in place of the controller 113. The controller 157 differs from the controller 113 shown in FIG. 1 in producing and outputting a test signal TS also for performing a test such as fault analysis of this semiconductor unit on the basis of a test command supplied externally.

In such a configuration, the controller 157 outputs an “H” level test signal TS on the basis of a test command supplied externally at the time of a test. In this case, when an go internal address signal /YP₀ is supplied to test the bank 25 ₁, the AND gate 158 ₁ allows the test signal TS to pass in the bank selective circuit 156 ₁. Thereby, since a column select signal YS₀ is outputted from the buffer 43 ₁, a test of the bank 25 ₁ becomes possible. In contrast to this, when an internal address signal YP₀ is supplied to test the bank 25 ₂, the AND gate 159 ₁ allows the test signal TS to pass in the bank selective circuit 156 ₁. Thereby, since a column select signal YS₁ is outputted from the buffer 44 ₁, a test of the bank 25 ₂ becomes possible.

On the other hand, at a normal time, since the controller 157 outputs an “L” level test signal TS, in the bank selective circuit 156 ₁ both an output signal of the AND gate 158 ₁ and an output signal of the AND gate 159 ₁ are always of an “L” level and column select signals YS₀ and YS₁ are outputted only on the basis of enable signals PN₀ and PN₁. The subsequent operation is almost similar to that of a semiconductor storage unit according to Embodiment 1, so that a description thereof will be omitted.

Like this, according to Embodiment 6, since the controller 157 produces a test signal TS and moreover the bank select circuit 155 ₁ is so arranged as to output only either of a column select signal YS₀ or a column select signal YS₁ on the basis of an internal address signal /YP₀ or an internal address signal YP₀, only either of the banks 25 ₁ or 25 ₂ configuring the bank block 154 ₁ is activated. Thus, the collision of data read out from individual banks 25 ₁ and 25 ₂ on the global I/O line 26 ₁ or 26 ₂ can be avoided.

G. Embodiment 7

Then, Embodiment 7 will be described. FIG. 26 is a block a diagram showing one configurational example of bank selective circuit 162 ₁ configuring a semiconductor storage unit according to Embodiment 7 of the present invention. In FIG. 26, like symbols are attached to parts corresponding to individual parts of FIG. 4 and a description thereof will be omitted. The bank selective circuit 162 ₁ differs from the bank selective circuit 29 ₁ shown in FIG. 4 in that an AND gate 163 ₁ for making a logical product of an output signal of the OR gate 45 ₁ and a write signal W indicating the write period of data supplied from the controller 113 configuring the peripheral circuit block 22, an AND gate 164 ₁ for making a logical product of an output signal of the OR gate 45 ₁ and a read signal R indicating the readout period of data supplied from the controller 113 configuring the peripheral circuit block 22, a delay element 165 ₁ for delaying an output signal of the AND gate 163 ₁ for a predetermined time, a delay element 166 ₁ for delaying an output signal of the AND gate 164 ₁ for a predetermined time and an OR gate 167 ₁ for making a logical sum of an output signal of the delay element 165 ₁ and the delay element 166 ₁ are anew provided in place of the delay element 46 ₁ and in that an output signal of the OR gate 167 ₁ is supplied to the input terminal of the buffer 47 ₁. The delay amount of the delay element 165 ₁ and that of the delay element 166 ₁ are set to mutual different values corresponding to the difference of skew lags (timing lags) between the data write time and the data readout time to reduce a skew lag.

Incidentally, other constituents and operations of a semiconductor storage unit according to Embodiment 7 are much the same as those of a semiconductor storage unit according to Embodiment 1 (See FIGS. 1 to 6 and 8) and therefore a description thereof will be omitted.

Like this, according to this embodiment, since delay elements 165 ₁ and 166 ₁ are provided in the bank selective circuit 162 ₁, a skew lag at the time of data write and a skew lad at the time of data readout can be separately reduced respectively and the design on the regulation of skews is facilitated. Hereinafter, the reason for this will be described.

At the time of data write, externally supplied data are conveyed to a sense amplifier via the global I/O line 26 ₁ or 26 ₂ and the local I/O lines 34 ₁ to 34 ₈ after amplified in a write amplifier configuring the I/O amplifiers 28 ₁ and 28 ₂ activated by a column multi-select delay signal YMD₀. Thus, prior to the turn ON of the column select switch based on a column select signal YS₀ or YS₁, a column multi-select delay signal YMD₀ has to be produced.

In contrast to this, at the time of data readout, data are read out from a memory cell via a bit line by turning ON the column select switch, conveyed via the local I/O lines 34 ₁ to 34 ₈ and the global I/O line 26 ₁ or 26 ₂ after amplified by use of a sense amplifier and amplified in a data amplifier configuring the I/O amplifier 28 ₁ or 28 ₂ activated by a column multi-select delay signal YMD₀. Thus, after the column select switch is turned ON on the basis of a column select signal YS₀ or YS₁, a column multi-select delay signal YMD₀ has to be produced and the column multi-select delay signal YMD₀ cannot be turned OFF till all the data are read out.

In other words, at the time of data write and at the time of data readout, the timing for turning ON the column select switch and the occurrence time of a column multi-select delay signal YMD₀ have to be made different.

Though having a delay depending on the performance of individual elements and a delay originating in delay elements (See FIG. 6), a column select signals YS₀ and YS₁ for controlling a plurality of column decoders configuring the column decoder groups 35 ₁ and 35 ₂, a column predecode latch signal YPT₀ for activating a plurality of column decoders configuring the column decoder groups 35 ₁ and 35 ₂ and a column select inverted signal YSB₀ for inactivating a plurality of column decoders configuring the column decoder groups 35 ₁ and 35 ₂ are produced synchronously with the leading of the corresponding clock CLK independently of the type of supplied commands. Accordingly, if a column multi-select delay signal YMD₀ for activating a data amplifier or write amplifier configuring the I/O amplifier 28 ₁ or 28 ₂ is produced regardless of the type of supplied command synchronously with the leading of a clock CLK corresponding in a uniform manner, e.g. in the case of a change from an access to the bank 25 ₁ to an access to the bank 25 ₂ by use of a switch signal SW₀ or SW₁ for a continuous readout of data from the bank 25 ₁ and 25 ₂ under a continuously issued read command RD, a period of simultaneous activation of data amplifiers configuring the I/O amplifiers 28 ₁ and 28 ₂ commonly connected to the data I/O bus 115 ₁ or 115 ₂ may occur. In this case, data read from the bank 25 ₁ and data read from the bank 25 ₂ collide with each other on the data I/O bus 115 ₁ and 115 ₂, thereby preventing data from being correctly read out.

Ordinarily, to prevent such a colliding period of data, the length of an activation period of a column multi-select delay signal YMD₀ is regulated in common with a write command WR and a read command RD, the occurrence timing of a column multi-select delay signal YMD₀ to a write command WR during the write of data is delayed by lengthening the period of a clock CLK or the period extending from the trailing of the prior column multi-select delay signal YMD₀ to the leading of the next clock CLK is prolonged during the readout of data. With an increase in storage capacity, however, the size of the bank 25 ₁ and the bank 25 ₂ increases and further the length of global I/O buses 26 ₁ and 26 ₂ also increases, thus leading to s prolonged period of data conveyance there, so that the above collision cannot be completely prevented only by regulating the length of the activation period of a column multi-select delay signal YMD₀ and a longer period of the clock CLK results in a lower speed of data write or data readout.

Under theses circumstances, in this embodiment, a skew lag at the write time of data and a skew lag at the readout time of data are made separately reducible by the provision of delay elements 165 ₁ and 166 ₁ in the bank selective circuit 162 ₁ mutually different in delay amount on the bank selective circuit, thereby facilitating the design on the regulation of skew lags and enabling the write and readout of data to be carried out at high speed.

H. Embodiment 8

Then, Embodiment 8 will be described. FIG. 27 is a circuit diagram showing a configurational example of bank selective circuit 171 ₁ of a semiconductor storage unit according to Embodiment 8. In FIG. 21, like symbols are attached to parts corresponding to individual parts of FIG. 12 and a description thereof will be omitted. The bank selective circuit 171 ₁ differs from the bank selective circuit 122 ₁ shown in FIG. 12 in that an AND gate 172 ₁ for making a logical product of an output signal of the OR gate 45 ₁ and a write signal W supplied from the controller 113 configuring the peripheral circuit block 22, an AND gate 173 ₁ for making a logical product of an output signal of the OR gate 45 ₁ and a read signal R supplied from the controller 113 configuring the peripheral circuit block 22, a delay element 174 ₁ for delaying an output signal of the AND gate 172 ₁ for a predetermined time, a delay element 175 ₁ for delaying an output signal of the AND gate 173 ₁ for a predetermined time and an OR gate 176 ₁ for making a logical sum of an output signal of the delay element 174 ₁ and the delay element 175 ₁ are anew provided in place of the delay element 46 ₁ and in that an output signal of the OR gate 176 ₁ is supplied to the input terminal of the buffer 119 ₁. The delay amount of the delay element 174 ₁ and that of the delay element 175 ₁ are set to mutually different values from each other corresponding to the difference of skew lags between the data write time and the data readout time to reduce a skew lag. Incidentally, other constituents of a semiconductor storage unit according to Embodiment 8 are much the same as those of a semiconductor storage unit according to Embodiment 2 (See FIG. 2 and 11) and therefore a description thereof will be omitted.

Next, in a semiconductor storage unit as configured above, the write operation of data into the bank 25 ₁ and the readout operation of data from the bank 25 ₁ will be described referring to the timing chart of FIG. 28.

When a write command WR (See FIG. 28 (1)) and address signals A₀ to A₁₅ supplied externally are taken in synchronously with the leading (See FIG. 28 (2)) of a first cycle in the clock CLK, internal address signals YP₀ to YP₁₂ (See FIG. 28 (3)), bank select signals BS₀ to BS₂ for selecting the bank 25 ₁ and an internal command signal RWCMD (See FIG. 28 (4)) are produced. Henceforth, letting the first cycle be a cycle with the leading of a clock CLK taken as the origin in which this write command WR was inputted, a description will be made. Thereby, since the bank decoder 111 ₁ decodes bank selection signals BS₀ to BS₂ and the inverted signals /BS₀ to /BS₂ thereof to output a select decision signal SD₀ (not shown in FIG. 28), the enable circuit 112 ₂ produces an enable signal PN₀ on the basis of the select decision signal SD₀ outputted from the corresponding bank decoder 111 ₁ and outputs it synchronously with the internal command signal RWCMD (See FIG. 28 (4)) supplied synchronously with the leading of the third cycle (See FIG. 28 (2)) in the clock CLK (See FIG. 28 (5)). Incidentally, this holds true similarly also for the first cycle as conventionally.

Thus, in the bank selective circuit 171 ₁ a column multi-select signal YMS₀ is outputted from the buffer 123 ₁ (See FIG. 28 (6)) and simultaneously a write signal W is supplied from the controller 113 configuring the peripheral circuit block 22, thereby allowing the AND gate 172 ₁ to pass an enable signal PN₀. Thereby, in the delay element 174 ₁, the enable signal PN₀ is delayed by a set delay amount, and thereafter outputted from the buffer 47 ₁ via the OR gate 176 ₁ as a column multi-select delay signal YMD₀ (See FIG. 28 (7)). Besides, the controller 113 produces a column release signal YR₀, a write burst signal WBT₀ or the like. Incidentally, in this embodiment, other control signals, input signals, circuits or the like that are not directly related to the embodiment are omitted, and thus only the enable circuit 112 and the controller 113 are described, aiming at simplifying the explanation.

On the other hand, since data supplied externally and inputted through the data I/O terminal DQ₀ are supplied to the I/O amplifier 28 ₁ or 28 ₂ via the data I/O bus 115 ₁ or 115 ₂ by the data I/O circuit 114 ₁, a write amplifier configuring an I/O amplifier 28 ₁ or 28 ₂, or the like is activated by a column multi-select delay signal YMD₀ (See FIG. 28 (7)) supplied from the bank selective circuit 171 ₁ to amplify data supplied via the data I/O bus 115 ₁ or 115 ₂ from the data I/O circuit 114 ₁, then conveying them to the global I/O line 26 ₁ or 26 ₂.

Besides, on the basis of an “H” level write burst signal WBT₀ and a column release signal YR₀, for example, supplied from the controller 113, the first column control section 49 ₁ produces a column release delay inverted signal YRD₀, a column release rear signal YRR₀ and a column release front signal YRF₀. Incidentally, since the write burst signal WBT₀ is a “H” level, the column release center signal YRC₀ remains a “L” level.

Thereby, in the second column control section 50 ₁, the column multi-select signal YMS₀ supplied from the bank selective circuit 171 ₁ is latched by a column release delay inverted signal YRD₀, a switch signal SW₀ is outputted and moreover the column selection inverted signal YSB₀ is released on the basis of the column release front signal YRF₀, whereas a column predecode latch signal YPT₀ is produced. Incidentally, since the column release center signal YRC₀ remains a “L” level, the precharge global signal PG₀ remains an “H” level.

Thus, on the basis of a switch signal SW₀, the bank 25 ₁ is selected and the global I/O line 26 ₁ or 26 ₂ is connected to the respective local I/O lines 34 ₁ to 34 ₈ perpendicular thereto, while signals predecoded by use of a predecoder configuring the column decoder group 35 ₁ or 35 ₂ are decoded on the basis of a column multi-select signal YMS₀ by use of a main decoder configuring the column decoder group 35 ₁ or 35 ₂ and become outputs of column selection switches in conformity with the timing of data arrival, i.e. after the lapse of time T₆ from the leading of a column multi-select delay signal YMD₀ as shown in FIGS. 28 (7) and (8). Assuming here that these column selection switches, for example, CSL₁O to CSL₁₃ are successively selected, sense amplifiers 33 of the corresponding bit lines are selected (See FIG. 28 (8)). Thereby, the data conveyed on the global I/O line 26 ₁ or 26 ₂ are conveyed to the selected memory cell of the memory cell array 31 ₁ via any of the local I/O lines 34 ₁ to 34 ₈.

Incidentally, the operation of a word driver 32 ₁ and a row decoder group 48 ₁ are not directly associated with this embodiment, so that a description thereof will be omitted.

By use of the operation described above, data are written into the selected memory cell of the bank 25 ₁.

Subsequently, when synchronously with the leading of the eighth cycle of a clock CLK (See FIG. 28 (2)), a read command RD (See FIG. 28 (1)) and address signals A₀ to A₁₅ supplied externally are taken in, internal address signals YP₀ to YP₁₂ (See FIG. 28 (3)), bank selection signals BS₀ to BS₂ for selecting the bank 25 ₁ and an internal command signal RWCMD (See FIG. 28 (4)) are produced. Thereby, since the bank decoder 111 ₁ decodes bank selection signals BS₀ to BS₂ and the inverted signals /BS₀ to /BS₂ thereof to output a select decision signal SD₀ (not shown in FIG. 28), the enable circuit 112 ₁ produces an enable signal PN₀ on the basis of the select decision signal SD₀ outputted from the corresponding bank decoder 111 ₁ and outputs it synchronously with the internal command signal RWCMD (See FIG. 28 (4)) supplied synchronous with the leading of an eighth cycle (See FIG. 28 (2)) in the clock CLK.

Thus, in the bank selective circuit 171 ₁, a column multi-select signal YMS₀ is outputted from the buffer 123 ₁ (See FIG. 28 (6)) and simultaneously a read signal R is supplied from the controller 113, thereby allowing the AND gate 173 ₁ to pass an enable signal PN₀. Thereby, in the delay element 175 ₁, the enable signal PN₀ is delayed by a set delay amount, i.e. as mentioned later an amount corresponding to the time taken from the detection and amplification of data read from a memory cell connected to the selected row of the memory cell array 31 ₂ till the data arrival at the I/O amplifier 28 ₁ or 28 ₂ via the local I/O, lines 34 ₁ to 34 ₄ and the global I/O line 26 ₁ or 26 ₂, and thereafter outputted from the buffer 47 ₁ via the OR gate 176 ₁ as a column multi-select delay signal YMD₀ (See FIG. 22 (7)). Besides, the controller 113 produces a column release signal YR₀, a write burst signal WBT₀ or the like.

On the other hand, on the basis of an “L” level write burst signal WBT₀ and a column release signal YR₀, for example, supplied from the controller 113, the first column control section 49 ₁ produces a column release delay inverted signal YRD₀, a column release rear signal YRR₀, a column release front signal YRF₀ and a column release center signal YRC₀. Thereby, in the second column control section 50 ₁, the column multi-select signal YMS₀ supplied from the bank selective circuit 171 ₁ is latched by a column release delay inverted signal YRD₀, a switch signal SW₀ is outputted and simultaneously the column select inverted signal YSB₀ is released on the basis of the column release front signal YRF₀, :whereas a column predecode latch signal YPT₀ is produced and further a precharge global signal PG₀ becoming only by one shot, e.g. an “L” level is produced.

Thus, on the basis of a switch signal SW₀, the bank 25 ₁ is selected and the global I/O line 26 ₁ or 26 ₂ is connected to the respective local I/O lines 34 ₁ to 34 ₄ perpendicular thereto, but the global I/O line 26 ₁ or 26 ₂ is short-circuited by means of the precharge global I/O circuit 36 ₁ or 36 ₂ only during the period of the precharge global signal PG₀ becoming an “L” level to set the global I/O line 26 ₁ or 26 ₂ to the precharge state. Besides, on the basis of a column selection signal YS₀, signals predecoded by use of a predecoder configuring the column decoder group 35 ₁ or 35 ₂ are decoded by use of a main decoder configuring the column decoder group 35 ₁ or 35 ₂ and become outputs of column selection switches. Assuming here that these column selection switches, for example, CSL₂₀ to CSL₂₁ are successively selected, sense amplifiers 33 ₁ or 33 ₂ of the corresponding bit lines are selected (See FIG. 28 (10)). Thereby, the sense amplifier 33 ₁ or 33 ₂ detects and amplifies the data read out from the memory cell connected to the selected row of the memory cell array 31 ₁, so that the detected or amplified data are conveyed to the I/O amplifier 28 ₁ or 28 ₂ via the local I/O lines 34 ₁ to 34 ₄ and the global I/O 26 ₁ or 26 ₂. Activated by the column multi-select delay signal YMD₀ (See FIG. 28 (8)) supplied from the bank selection circuit 171 ₁ in conformity with the timing of data arrival as mentioned above, i.e. after the lapse of time T7 from the leading of a column select switch CSL₂₀ as shown in FIGS. 28 (7) and (9), data amplifier configuring the I/O amplifier 28 ₁ or 28 ₂, or the like conveys the supplied data to the data I/O circuit 114 ₁ via the data I/O bus 115 ₁ or 115 ₂ after amplified. Thus, the data I/O circuit 114 ₁ successively outputs the supplied data through the data I/O terminal DQ₀. Incidentally, the operation of a word driver 32 ₁ and a row decoder group 48 ₁ are not directly associated with this embodiment, so that a description thereof will be omitted.

By use of the operation described above, data are read out from the selected memory cell of the bank 25 ₁.

Incidentally, since other operations of a semiconductor storage unit according to Embodiment 8 are much the same as those of a semiconductor storage unit according to Embodiment 2 (See FIGS. 13 and 14), a description thereof will be omitted. Embodiment 8 can be applied to Embodiment 4 as it is.

Like this, according to this embodiment, a skew lag at the write time of data and a skew lag at the readout time of data are made separately reducible by the provision of delay elements 174 ₁ and 175 ₁ in the bank selective circuit 171 ₁, thereby facilitating the design on the regulation of skew lags and enabling the write and readout of data to be carried out at high speed.

I. Embodiment 9

Then, Embodiment 9 will be described. FIG. 29 is a circuit diagram showing a configurational example of bank selective circuit 181 ₁ of a semiconductor storage unit according to Embodiment 9. In FIG. 29, like symbols are attached to parts corresponding to individual parts of FIG. 16 and a description thereof will be omitted. The bank selective circuit 181 ₁ differs from the bank selective circuit 126 ₁ shown in FIG. 16 in that an AND gate 182 ₁ for making a logical product of an enable signal PN₀ and a write signal W supplied from the controller 113 configuring the peripheral circuit block 125, an AND gate 183 ₁ for making a logical product of an enable signal PN₀ and a read signal R supplied from the controller 113 configuring the peripheral circuit block 125, a delay element 184 ₁ for delaying an output signal of the AND gate 182 ₁ for a predetermined time, a delay element 185 ₁ for delaying an output signal of the AND gate 183 ₁ for a predetermined time and an OR gate 186 ₁ for making a logical sum of an output signal of the delay element 184 ₁ and the delay element 185 ₁ are anew provided in place of the delay element 46 ₁ and in that an output signal of the OR gate 186 ₁ is supplied to the input terminal of the buffer 47 ₁. The delay amount of the delay element 184 ₁ and that of the delay element 185 ₁ are set to mutually different values corresponding to the difference of skew lags between the data write time and the data readout time to reduce a skew lag. Incidentally, other constituents and operations of a semiconductor storage unit according to Embodiment 9 are much the same as the constituents and operations of a semiconductor storage unit according to Embodiment 3 (See FIGS. 2, 15, 17 and 18) and therefore a description thereof will be omitted.

Like this, according to this embodiment, a skew lag at the write time of data and a skew lag at the readout time of data are made separately reducible by the provision of delay elements 184 ₁ and 185 ₁ in the bank selective circuit 181 ₁, thereby facilitating the design on the regulation of skew lags and enabling the write and readout of data to be carried out at high speed.

J. Embodiment 10

Then, Embodiment 10 will be described. FIG. 30 is a circuit diagram showing a configurational example of bank selective circuit 191 ₁ of a semiconductor storage unit according to Embodiment 10. In FIG. 30, like symbols are attached to parts corresponding to individual parts of FIG. 22 and a description thereof will be omitted. The bank selective circuit 191 ₁ differs from the bank selective circuit 143 ₁ shown in FIG. 22 in that an AND gate 192, for making a logical product of an output signal of the OR gate 144 ₁ and a write signal W supplied from the controller 145 configuring the peripheral circuit block 141, an AND gate 193 ₁ for making a logical product of an output signal of the OR gate 144 ₁ and a read signal R supplied from the controller 145 configuring the peripheral circuit block 141, a delay element 194 ₁ for delaying an output signal of the AND gate 192 ₁ for a predetermined time, a delay element 195 ₁ for delaying an output signal of the AND gate 193 ₁ for a predetermined time and an OR gate 196 ₁ for making a logical sum of an output signal of the delay element 194 ₁ and the delay element 195 ₁ are anew provided in place of the delay element 46 ₁ and in that an output signal of the OR gate 196 ₁ is supplied to the input terminal of the buffer 47 ₁. The delay amount of the delay element 194 ₁ and that of the delay element 195 ₁ are set to mutually different values corresponding to the difference of skew lags between the data write time and the data readout time to reduce a skew lag. Incidentally, other constituents and operations of a semiconductor storage unit according to Embodiment 10 are much the same as those of a semiconductor storage unit according to Embodiment 5 (See FIG. 2, 21 and 23) and therefore a description thereof will be omitted.

Like this, according to this embodiment, a skew lag at the write time of data and a skew lag at the readout time of data are made separately reducible by the provision of delay elements 194 ₁ and 195 ₁ in the bank selective circuit 191 ₁, thereby facilitating the design on the regulation of skew lags and enabling the write and readout of data to be carried out at high speed.

K. Embodiment 11

Then, Embodiment 11 will be described. FIG. 31 is a circuit diagram showing a configurational example of bank selective circuit 201 ₁ of a semiconductor storage unit according to Embodiment 11. In FIG. 31, like symbols are attached to parts corresponding to individual parts of FIG. 25 and a description thereof will be omitted. The bank selective circuit 201 ₁ differs from the bank selective circuit 156 ₁ shown in FIG. 25 in that an AND gate 202 ₁ for making a logical product of an output signal of the OR gate 45 ₁ and a write signal W supplied from the controller 157 configuring the peripheral circuit block 155, an AND gate 203 ₁ for making a logical product of an output signal of the OR gate 45 ₁ and a read signal R supplied from the controller 157 configuring the peripheral circuit block 155, a delay element 204 ₁ for delaying an output signal of the AND gate 202 ₁ for a predetermined time, a delay element 205 ₁ for delaying an output signal of the AND gate 203 ₁ for a predetermined time and an OR gate 206 ₁ for making a logical sum of an output signal of the delay element 204 ₁ and the delay element 205 ₁ are anew provided in place of the delay element 46 ₁ and in that an output signal of the OR gate 206 ₁ is supplied to the input terminal of the buffer 47 ₁. The delay amount of the delay element 204 ₁ and that of the delay element 205 ₁ are set to mutually different values corresponding to the difference of skew lags between the data write time and the data readout time to reduce a skew lag.

Incidentally, other constituents and operations of a semiconductor storage unit according to Embodiment 11 are much the same as those of a semiconductor storage unit according to Embodiment 6 (See FIGS. 2 and 24) and therefore a description thereof will be omitted.

Like this, according to this embodiment, a skew lag at the write time of data and a skew lag at the readout time of data are made separately reducible by the provision of delay elements 204 ₁ and 205 ₁ in the bank selective circuit 201 ₁, thereby facilitating the design on the regulation of skew lags and enabling the write and readout of data to be carried out at high speed.

Heretofore, embodiments of the present invention have been described in details by referring to the drawings, but the specific configurations are not limited to these embodiments and changes and variations in design without departing from the spirit or scope of the following claims are included in the present invention.

In these embodiments, for example, applications of the present invention to nonsynchronous semiconductor storage units were shown, but the present invention is not limited to them and may be applied to a synchronous semiconductor storage unit, needless to say.

Besides, in these embodiments, the chip layout is described to be the one shown in FIG. 2, but is not limited to this. As shown in FIG. 32, for example, the chip layout may be represented as comprising four functional blocks 21, to 21 ₄ and two peripheral circuit blocks 22 a and 22 b.

Furthermore, in these embodiments, the bank blocks 23, and 23 ₂ were described to be related in the plane symmetry about a plane perpendicular to the sheet surface in the portion of the peripheral circuit block 24 ₁ in a single functional block 21 ₁ as shown in FIG. 2 (1) except for the word drivers 32 ₁ and 32 ₂ and the word drivers 32 ₃ and 33 ₄, but the present invention is not limited to this. In a single functional block 21 ₁, for example, two bank blocks of the same shape as that of the bank block 23 ₁ or the bank block 23 ₂ may be arranged on both sides of the peripheral circuit block 24 ₁. Also in the chip layout shown in FIG. 2 (2) and FIG. 32, all bank blocks may be identical or different in shape similarly. Still further, the arranging direction of bank blocks 23 and peripheral circuit blocks 24 may be horizontal, a direction turned for 90 degrees of FIG. 2 (2), not vertical as shown in FIG. 2 (2).

Besides, shown in these embodiment is a case where the banks 25 ₁ to 25 ₄ are respectively divided in two left-to-right, global I/O lines 26 ₁ to 26 ₄ are correspondingly disposed with I/O amplifiers 28 ₁ to 28 ₄ provided and precharge global I/O circuits 36 ₁ to 36 ₄ are respectively provided for individual global I/O lines 26 ₁ to 26 ₄, but the present invention is not limited to this and the number of divided banks 25 ₁ to 25 ₄, the number of accompanying global I/O lines 26 ₁ to 26 ₄, the number of I/O amplifiers 28 ₁ to 28 ₄, the number of their constituent write amplifiers and data amplifiers and the number of precharge global I/O lines 36 ₁ to 36 ₄ may be arbitrary. Similarly, the number of divided column decoder groups 35 ₁ to 35 ₄ and the number of their constituent column decoders may be arbitrary. Furthermore, the number of constituent memory cell arrays for one bank 25 may be also arbitrary. Besides, with respect to individual banks 25 ₁ to 25 ₄, no detailed description is found in FIGS. 1 and 2, but they may comprise subarrays or subword driver, for example, as disclosed in Japanese Patent Application No. 9-305505.

Furthermore, examples of 3-level convergence of wiring lines are shown in Embodiments 1 to 3, an example of reducing the number of activated memory cells in a bank relative to Embodiment 2 is shown in Embodiment 4, examples of tests by use of test signals for Embodiments 3 and 1 are respectively in Embodiments 5 and 6 and examples of reducing a skew lag for Embodiment 1, Embodiments 2 and 4, Embodiment 3, Embodiment 5 and Embodiment 6 are respectively shown in Embodiments 7 to 11, but the present invention is not limited to this. In other words, an arrangement of reducing the number of memory cells in a bank, activated by use of address signals, according to Embodiment 4 may be applied to Embodiments 1 and 3 and an arrangement of tests by use of test signals according to Embodiment 5 and 6 may be applied to Embodiments 2 and 4.

Besides, in the description of operations for these embodiments, a description was made only of the write of data into the bank 25 ₁ and readout of data from the bank 25 ₂, the write of data into the bank 25 ₁ and readout of data from the bank 25 ₁ and the continuous read of data from the bank 25 ₁ and 25 ₂ as variations of operations, but the present invention is not limited to this. Namely, the present invention is also applicable to the readout of data from the bank 25 ₁ and write of data into the bank 25 ₂, the continuous write of data into the bank 25 ₁ and the bank 25 ₂ or inverted operation in the sequence of an access to the bank 25 ₂ and an access to the bank 25 ₁, a forced access to the latter on account of occurrence of an interruption during the access to the conventional or the like.

Incidentally, in case of occurrence of an interruption, the read/write of the remaining data from/into the access-interrupted bank is disabled.

Furthermore, in Embodiments 7 to 11, examples of read signals R and write signals W being independent with each other are shown, but the present invention is not limited to this and one signal may be the inverted of another and a write burst signal WBT outputted from a controller and its inverted signal may be employed instead,

According to one arrangement of the present invention, as described above, the number of wiring lines can be reduced. Thereby, the chip area of a semiconductor storage unit can be further reduced. Besides, according to another arrangement of the present invention, tests such as fault analysis can be made normally in a short time. Furthermore, according to yet another arrangement of the present invention, the number of activated memory cells in a bank can be reduced.

Still further, according to yet another arrangement of the present invention, a skew lag at the time of data write and a skew lag at the time of data readout are respectively reduced separately, the design on the regulation of skews is facilitated and simultaneously the collision of data on a data I/O bus can be prevented. Besides, in particular, the write and read of data during the switching period of control over two banks becomes executable at high speed. Furthermore, the importance is in that the connection to a local I/O line and to a global I/O line is switchable without damages to data.

The invention may be embodied in other specific forms without departing from the spirit or essential characteristic thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

The entire disclosure of Japanese Patent Application No. 10-331793 (Filed on Nov. 20, 1998) including specification, claims, drawings and summary are incorporated herein by reference in its entirety. 

What is claimed is:
 1. A semiconductor storage unit comprising: a plurality of bank blocks including a plurality of banks that are adjacent to each other and have a memory cell array including a plurality of memory cells placed in a matrix form, a plurality of global I/O lines provided in parallel to an arranging direction of said banks and in common therewith for conveying data read out from any of the memory cells in the memory cell array configuring said plurality of banks, or data to be written in any individual one of the plurality of memory cells, a plurality of I/O amplifiers connected to individual ones of the plurality of global I/O lines for amplifying data conveyed by corresponding ones of the plurality of global I/O lines, or data to be conveyed from an individual global I/O line to a corresponding global I/O line, and a plurality of column decoders provided in common with said plurality of banks for respectively outputting a plurality of column selection switches for setting selected ones of a plurality of bit lines corresponding to the memory cell array configuring any one of the plurality of banks at the selected state; and a plurality of bank selective circuits, provided in common with banks configuring the corresponding bank block for each of said bank blocks which create a column decoder activation signal for activating the corresponding column decoder on the basis of at least one multi-bit bank address signal for selecting any individual one of all banks configuring said bank blocks and an I/O amplifier activation signal for activating at least a corresponding one of the plurality of I/O amplifiers.
 2. The semiconductor storage unit as set forth in claim 1, wherein said bank selective circuits creates said column decoder activation signal and said I/O amplifier activation signal in accordance with a bank block selection signal for selecting a corresponding bank block, said column decoder signal being created from a part of a plurality of bits used in configuring said multi-bit bank address signal.
 3. The semiconductor storage unit as set forth in claim 1, wherein in place of said column decoder activating signal and said I/O amplifier activation signal, said bank selective circuits output the respective signals making logical sums of the multi-bits corresponding to the banks configuring the bank block of multi-bit column address signals with said column decoder activating signal and said I/O amplifier activation signal.
 4. The semiconductor storage unit as set forth in claim 1, wherein said bank blocks each comprises a connection selective circuit with a plurality of local I/O lines provided perpendicularly to said global I/O lines for said individual memory cell array and connected to the corresponding global I/O line so as to convey data read from any of the memory cells or data to be written into any of the memory cells in the corresponding memory cell array that selects the connection between said local I/O lines and their corresponding global I/O lines at predetermined intervals on the basis of said column decoder activating signal.
 5. The semiconductor storage unit asset forth in claim 1, wherein said bank selective circuits output said I/O amplifier activation signal after the delay of a predetermined time from the input of said multi-bit bank address signal.
 6. The semiconductor storage unit as set forth in claim 5, wherein with the difference of a predetermined time between the write time of data and the readout time of data, said bank selective circuits output said I/O amplifier activation signal.
 7. The semiconductor storage unit as set forth in claim 1, wherein said bank selective circuits makes a logical sum of bank selection signals for selecting any one of the banks configuring the corresponding bank block created from said multi-bit bank address signal and creates said I/O amplifier activation signal.
 8. The semiconductor storage unit as set forth in claim 7, wherein said bank selective circuits makes a logical sum of bank selection signals for selecting any one of the banks configuring the corresponding bank block created from said multi-bit bank address signal and creates said column decoder activation signal.
 9. The semiconductor storage unit as set forth in claim 7, wherein in place of said column decoder activating signal and said I/O amplifier activation signal, said bank selective circuits output the respective signals making logical sums of the multi-bits corresponding to the banks configuring the bank block of multi-bit column address signals with said column decoder activating signal and said I/O amplifier activation signal.
 10. The semiconductor storage unit as set forth in claim 7, wherein said bank blocks each comprises a connection selective circuit with a plurality of local I/O lines provided perpendicularly to said global I/O lines for said individual memory cell array and connected to the corresponding global I/O line so as to convey data read from any of the memory cells or data to be written into any of the memory cells in the corresponding memory cell array that selects the connection between said local I/O lines and their corresponding global I/O lines at predetermined intervals on the basis of said column decoder activating signal.
 11. The semiconductor storage unit as set forth in claim 7, wherein said bank selective circuits output said I/O amplifier activation signal after the delay of a predetermined time from the input of said multi-bit bank address signal.
 12. The semiconductor storage unit as set forth in claim 11, wherein with the difference of a predetermined time between the write time of data and the readout time of data, said bank selective circuits output said I/O amplifier activation signal.
 13. The semiconductor storage unit as set forth in claim 1, wherein said bank selective circuits makes a logical sum of bank selection signals for selecting any one of the banks configuring the corresponding bank block created from said multi-bit bank address signal and creates said column decoder activation signal.
 14. The semiconductor storage unit as set forth in claim 13, wherein in place of said column decoder activating signal and said I/O amplifier activation signal, said bank selective circuits output the respective signals making logical sums of the multi-bits corresponding to the banks configuring the bank block of multi-bit column address signals with said column decoder activating signal and said I/O amplifier activation signal.
 15. The semiconductor storage unit as set forth in claim 13, wherein said bank blocks each comprises a connection selective circuit with a plurality of local I/O lines provided perpendicularly to said global I/O lines for said individual memory cell array and connected to the corresponding global I/O line so as to convey data read from any of the memory cells or data to be written into any of the memory cells in the corresponding memory cell array that selects the connection between said local I/O lines and their corresponding global I/O lines at predetermined intervals on the basis of said column decoder activating signal.
 16. The semiconductor storage unit as set forth in claim 13, wherein said bank selective circuits output said I/O amplifier activation signal after the delay of a predetermined time from the input of said multi-bit bank address signal.
 17. The semiconductor storage unit as set forth in claim 16, wherein with the difference of a predetermined time between the write time of data and the readout time of data, said bank selective circuits output said I/O amplifier activation signal.
 18. A semiconductor storage unit comprising: a plurality of bank blocks including a plurality of banks that are adjacent to each other and have a memory cell array including a plurality of memory cells placed in a matrix form, a plurality of global I/O lines provided in parallel to the arranging direction of said banks and in common therewith for conveying data read out from any of the memory cells in the memory array configuring said banks or data to be written in any of the memory cells, a plurality of I/O amplifiers connected to individual global I/O lines for amplifying data conveyed by corresponding global I/O lines or data to be conveyed from one global I/O line to a corresponding global I/O line, and a plurality of column decoders provided in common with said banks for respectively outputting a plurality of column selection switches for setting the bit lines corresponding to the memory cell array configuring any of the banks at the selected state; and a plurality of bank selective circuits, provided in common with banks configuring the corresponding bank block for each of said bank blocks which create a column decoder activation signal for activating the corresponding column decoder on the basis of multi-bit bank address signal for selecting any one of all banks configuring said bank blocks and an I/O amplifier activation signal for activating a corresponding I/O amplifier, wherein said bank selective circuits comprises a test circuit that makes a logical product of a test signal for accomplishing a fault analysis or an estimation test with a bank selection signal or a bank block selection signal to create at least one of said I/O amplifier activation signal or said column decoder activation signal and make a logical sum between the respective signals making a logical product of said test signal with the multi-bits corresponding to the banks configuring the bank block of a multi-bit column address signal and the signal making a logical product of the inverted signal of said test signal with said column decoder activation signal to create a second column decoder activation signal for each bank.
 19. A semiconductor storage unit comprising: a plurality of bank blocks including a plurality of banks that are adjacent to each other and have a memory cell array including a plurality of memory cells placed in a matrix form, a plurality of global I/O lines provided in parallel to the arranging direction of said banks and in common therewith for conveying data read out from any of the memory cells in the memory array configuring said banks or data to be written in any of the memory cells, a plurality of I/O amplifiers connected to individual global I/O lines for amplifying data conveyed by corresponding global I/O lines or data to be conveyed from one global I/O line to a corresponding global I/O line, and a plurality of column decoders provided in common with said banks for respectively outputting a plurality of column selection switches for setting the bit lines corresponding to the memory cell array configuring any of the banks at the selected state; and a plurality of bank selective circuits, provided in common with banks configuring the corresponding bank block for each of said bank blocks which create a column decoder activation signal for activating the corresponding column decoder on the basis of multi-bit bank address signal for selecting any one of all banks configuring said bank blocks and an I/O amplifier activation signal for activating a corresponding I/O amplifier, wherein said bank selective circuits makes a logical sum of bank selection signals for selecting any one of the banks configuring the corresponding bank block created from said multi-bit bank address signal and creates said I/O amplifier activation signal, wherein said bank selective circuits comprises a test circuit that make a logical sum of a test signal for accomplishing a fault analysis or an estimation test with said bank selection signal or a bank block selection signal to create at least one of said I/O amplifier activation signal or said column decoder activation signal and make a logical sum between the respective signals making a logical product of said test signal with the multi-bits corresponding to the banks configuring the bank block of a multi-bit column address signal and the signal making a logical product of the inverted signal of said test signal with said column decoder activation signal to create a second column decoder activation signal for each bank.
 20. A semiconductor storage unit comprising: a plurality of bank blocks including a plurality of banks that are adjacent to each other and have a memory cell array including a plurality of memory cells placed in a matrix form, a plurality of global I/O lines provided in parallel to the arranging direction of said banks and in common therewith for conveying data read out from any of the memory cells in the memory array configuring said banks or data to be written in any of the memory cells, a plurality of I/O amplifiers connected to individual global I/O lines for amplifying data conveyed by corresponding global I/O lines or data to be conveyed from one global I/O line to a corresponding global I/O line, and a plurality of column decoders provided in common with said banks for respectively outputting a plurality of column selection switches for setting the bit lines corresponding to the memory cell array configuring any of the banks at the selected state; and a plurality of bank selective circuits, provided in common with banks configuring the corresponding bank block for each of said bank blocks which create a column decoder activation signal for activating the corresponding column decoder on the basis of multi-bit bank address signal for selecting any one of all banks configuring said bank blocks and an I/O amplifier activation signal for activating a corresponding I/O amplifier, wherein said bank selective circuits makes a logical sum of bank selection signals for selecting any one of the banks configuring the corresponding bank block created from said multi-bit bank address signal and creates said column decoder activation signal, wherein said bank selective circuits comprises a test circuit that make a logical sum of a test signal for accomplishing a fault analysis or an estimation test with said bank selection signal or a bank block selection signal to create at least one of said I/O amplifier activation signal or said column decoder activation signal and make a logical claim between the respective signals making a logical product of said test signal with the multi-bits corresponding to the banks configuring the bank blocks of a multi-bit column address signal and the signal making a logical product of the inverted signal of said test signal with said column decoder activation signal to create a second column decoder activation signal for each bank.
 21. A semiconductor storage unit comprising: a plurality of bank blocks including a plurality of banks that are adjacent to each other and have a memory cell array including a plurality of memory cells placed in a matrix form, a plurality of global I/O lines provided in parallel to the arranging direction of said banks and in common therewith for conveying data read out from any of the memory cells in the memory array confiding said banks or data to be written in any of the memory cells, a plurality of I/O amplifiers connected to individual global I/O lines for amplifying data conveyed by corresponding global I/O lines or data to be conveyed from one global I/O line to a corresponding global I/O line, and a plurality of column decoders provided in common with said banks for respectively outputting a plurality of column selection switches for setting the bit lines corresponding to the memory cell array configuring any of the banks at the selected state; and a plurality of bank selective circuits, provided in common with banks configuring the corresponding bank block for each of said bank blocks which create a column decoder activation signal for activating the corresponding column decoder on the basis of multi-bit bank address signal for selecting any one of all banks configuring said bank blocks and an I/O amplifier activation signal for activating a corresponding I/O amplifier, wherein said bank selective circuits make a logical sum between the respective signals making a logical product of a test signal for accomplishing a fault analysis or an estimation test with the multi-bits corresponding to the banks configuring the bank block of a multi-bit column address signal and a bank selection signal or a bank block selection signal to create least one of said I/O amplifier activation signal or said column decoder activation signal.
 22. A semiconductor storage unit comprising: a plurality of bank blocks including a plurality of banks that are adjacent to each other and have a memory cell array including a plurality of memory cells placed in a matrix form, a plurality of global I/O lines provided in parallel to the arranging direction of said banks and in common therewith for conveying data read out from any of the memory cells in the memory array configuring said banks or data to be written in any of the memory cells, a plurality of I/O amplifiers connected to individual global I/O lines for amplifying data conveyed by corresponding global I/O lines or data to be conveyed from one global I/O line to a corresponding global I/O line, and a plurality of column decoders provided in common with said banks for respectively outputting a plurality of column selection switches for setting the bit lines corresponding to the memory cell array configuring any of the banks at the selected state; and a plurality of bank selective circuits, provided in common with banks configuring the corresponding bank block for each of said bank blocks which create a column decoder activation signal for activating the corresponding column decoder on the basis of multi-bit bank address signal for selecting any one of all banks configuring said bank blocks and an I/O amplifier activation signal for activating a corresponding I/O amplifier, wherein said bank selective circuits makes a logical sum of bank selection signals for selecting any one of the banks configuring the corresponding bank block created from said multi-bit bank address signal and creates said PO amplifier activation signal, wherein said bank selective circuits make a logical sum between the respective signals making a logical product of a test signal for accomplishing a fault analysis or an estimation test with the multi-bits corresponding to the banks configuring the bank block of a multi-bit column address signal and said bank selection signal or a bank block selection signal to create at least one of said I/O amplifier activation signal or said column decoder activation signal.
 23. A semiconductor storage unit comprising: a plurality of bank blocks including a plurality of banks that are adjacent to each other and have a memory cell array including a plurality of memory cells placed in a matrix form, a plurality of global I/O lines provided in parallel to the arranging direction of said banks and in common therewith for conveying data read out from any of the memory cells in the memory array configuring said banks or data to be written in any of the memory cells, a plurality of I/O amplifiers connected to individual global I/O lines for amplifying data conveyed by corresponding global I/O lines or data to be conveyed from one global I/O line to a corresponding global I/O line, and a plurality of column decoders provided in common with said banks for respectively outputting a plurality of column selection switches for setting the bit lines corresponding to the memory cell array configuring any of the banks at the selected state; and a plurality of bank selective circuits, provided in common with banks configuring the corresponding bank block for each of said bank blocks which create a column decoder activation signal for activating the corresponding column decoder on the basis of multi-bit bank address signal for selecting any one of all banks confiding said bank blocks and an I/O amplifier activation signal for activating a corresponding I/O amplifier, wherein said bank selective circuits makes a logical sum of bank selection signals for selecting any one of the banks configuring the corresponding bank block created from said multi-bit bank address signal and creates said column decoder activation signal, wherein said bank selective circuits make a logical sum between the respective signals making a logical product of a test signal for accomplishing a fault analysis or an estimation test with the multi-bits corresponding to the banks configuring the bank block of a multi-bit column address signal and said bank selection signal or a bank block selection signal to create at least one of said I/O amplifier activation signal or said column decoder activation signal.
 24. A semiconductor storage unit comprising: a plurality of bank blocks including a plurality of banks that are adjacent to each other and have a memory cell array including a plurality of memory cells placed in a matrix form, a plurality of global I/O lines provided in parallel to the arranging direction of said banks and in common therewith for conveying data read out from any of the memory cells in the memory array configuring said banks or data to be written in any of the memory cells, a plurality of I/O amplifiers connected to individual global I/O lines for amplifying data conveyed by corresponding global I/O lines or data to be conveyed from one global I/O line to a corresponding global I/O line, and a plurality of column decoders provided in common with said banks for respectively outputting a plurality of column selection switches for setting the bit lines corresponding to the memory cell array configuring any of the banks at the selected state; and a plurality of bank selective circuits, provided in common with banks configuring the corresponding bank block for each of said bank blocks which create a column decoder activation signal for activating the corresponding column decoder on the basis of multi-bit bank address signal for selecting any one of all banks configuring said bank blocks and an I/O amplifier activation signal for activating a corresponding I/O amplifier, further comprising: an initialization circuit, provided corresponding to said global I/O lines, for short-circuiting and initializing the corresponding global I/O line on the basis of said column decoder activating signal at the time of switchover from the readout of data from a certain bank to the readout of data from another bank in a continuous readout case of data from a plurality of banks configuring one and the same bank block.
 25. A semiconductor storage unit comprising: a plurality of bank blocks including a plurality of banks that are adjacent to each other and have a memory cell array including a plurality of memory cells placed in a matrix form, a plurality of global I/O lines provided in parallel to the arranging direction of said banks and in common therewith for conveying data read out from any of the memory cells in the memory array configuring said banks or data to be written in any of the memory cells, a plurality of I/O amplifiers connected to individual global I/O lines for amplifying data conveyed by corresponding global I/O lines or data to be conveyed from one global I/O line to a corresponding global I/O line, and a plurality of column decoders provided in common with said banks for respectively outputting a plurality of column selection switches for setting the bit lines corresponding to the memory cell array configuring any of the banks at the selected state; and a plurality of bank selective circuits, provided in common with banks configuring the corresponding bank block for each of said bank blocks which create a column decoder activation signal for activating the corresponding column decoder on the basis of multi-bit bank address signal for selecting any one of all banks configuring said bank blocks and an I/O amplifier activation signal for activating a corresponding I/O amplifier, wherein said bank selective circuits makes a logical sum of bank selection signals for selecting any one of the banks configuring the corresponding bank block created from said multi-bit bank address signal and creates said I/O amplifier activation signal, further comprising: an initialization circuit, provided corresponding to said global I/O lines for short-circuiting and initializing the corresponding global I/O line on the basis of said column decoder activating signal at the time of switchover from the readout of data from a certain bank to the readout of data from another bank in a continuous readout case of data from a plurality of banks configuring one and the same bank block.
 26. A semiconductor storage unit comprising: a plurality of bank blocks including a plurality of banks that are adjacent to each other and have a memory cell array including a plurality of memory cells placed in a matrix form, a plurality of global I/O lines provided in parallel to the arranging direction of said banks and in common therewith for conveying data read out from any of the memory cells in the memory array configuring said banks or data to be written in any of the memory cells, a plurality of I/O amplifiers connected to individual global I/O lines for amplifying data conveyed by corresponding global I/O lines or data to be conveyed from one global I/O line to a corresponding global I/O line, and a plurality of column decoders provided in common with said banks for respectively outputting a plurality of column selection switches for setting the bit lines corresponding to the memory cell array configuring any of the banks at the selected state; and a plurality of bank selective circuits, provided in common with banks configuring the corresponding bank block for each of said bank blocks which create a column decoder activation signal for activating the corresponding column decoder on the basis of multi-bit bank address signal for selecting any one of all banks configuring said bank blocks and an PO amplifier activation signal for activating a corresponding I/O amplifier, wherein said bank selective circuits makes a logical sum of bank selection signals for selecting any one of the banks configuring the corresponding bank block created from said multi-bit bank address signal and creates said column decoder activation signal, further comprising: an initialization circuit, provided corresponding to said global I/O line for short-circuiting and initializing the corresponding global I/O line on the basis of said column decoder activation signal at the time of switchover from the readout of data from a certain bank to the readout of data from another bank in a continuous readout case of data from a plurality of banks configuring one and the same block. 